LCMXO3LF-4300E-5UWG81CTR

The LCMXO3LF-4300E-5UWG81CTR is a MachXO3 family FPGA in an 81-WLCSP surface-mount package designed for commercial embedded designs. It implements a flexible FPGA architecture with 4,320 logic elements, on-chip memory, programmable I/O and integrated system features drawn from the MachXO3 family data sheet.

This device is targeted at compact, low-profile applications that require reconfigurable logic, interface integration and embedded peripherals in a commercial-temperature, RoHS-compliant package.

Key Features

• Logic Capacity — 4,320 logic elements provide programmable resources for glue logic, control functions and small to medium FPGA tasks.
• Embedded Memory — Approximately 0.094 Mbits of embedded memory (94,208 total RAM bits) for data buffering, state storage and small on-chip tables.
• I/O — 63 general-purpose I/O pins delivered through programmable I/O cells, suitable for interfacing sensors, displays and peripheral devices.
• Package & Mounting — 81-WLCSP (3.80×3.69 mm) package, surface-mount mounting for compact board designs and low-profile integration.
• Power — Core supply range 1.14 V to 1.26 V to match tight power-domain requirements in modern systems.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Non-volatile, Multi-time Programmable Configuration — MachXO3 family capability for non-volatile, reprogrammable configuration as described in the product data.
• On-chip Clocking & PLLs — Flexible on-chip clocking and sysCLOCK Phase Locked Loops (PLLs) for internal clock management, as described in the MachXO3 family data sheet.
• Embedded Hardened IP — MachXO3 family includes embedded hardened IP functions such as I²C, SPI and timer/counter blocks for common peripheral needs.
• Power Saving & Standby Options — Family-level support for standby mode and power saving options is included in the MachXO3 data sheet.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Glue — Implement protocol adapters and glue logic between peripheral devices and host controllers using the device’s I/O and programmable logic.
• User Interface Control — Manage buttons, indicators, displays and touch sensor input with compact, low-profile integration in consumer equipment.
• Sensor Aggregation and Preprocessing — Aggregate multiple sensor inputs and perform lightweight preprocessing using on-chip logic and memory.
• Embedded Control Functions — Implement control sequencing, timers and small state machines using the device’s logic elements and embedded IP resources.

Unique Advantages

• Compact WLCSP Package: 81-WLCSP (3.80×3.69 mm) enables very small board footprints and low-profile assemblies.
• Balanced Integration: Combines 4,320 logic elements with embedded memory and hardened IP to reduce external components and simplify BOM.
• Flexible I/O and Clocking: Programmable I/O cells, source-synchronous I/O capability and on-chip PLLs provide adaptable interfacing and timing options.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C to match a wide range of commercial embedded product requirements.
• Non-volatile Reconfiguration: Multi-time programmable, non-volatile configuration reduces the need for external configuration memory in many designs.
• Regulatory Friendly: RoHS compliance supports environmental and supply-chain requirements for commercial electronics.

Why Choose LCMXO3LF-4300E-5UWG81CTR?

The LCMXO3LF-4300E-5UWG81CTR positions MachXO3 family capabilities in a compact WLCSP package, delivering 4,320 logic elements, approximately 94,208 bits of embedded memory and 63 I/O pins for commercial embedded designs. Its combination of programmable logic, on-chip memory and hardened IP functions provides a practical and integrated option for interface logic, control and small system tasks.

This device is well suited to design teams seeking a compact, reprogrammable solution for commercial products where board space, integration and configurable I/O are priorities. The MachXO3 family architecture and documented features provide a clear upgrade path and predictable integration within supported design flows.

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