LCMXO3LF-4300E-5UWG81CTR1K

IC FPGA 63 I/O 81WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP

Quantity 367 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package81-WLCSP (3.80x3.69)GradeCommercialOperating Temperature0°C – 85°C
Package / Case81-UFBGA, WLCSPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300E-5UWG81CTR1K – MachXO3 FPGA, 4,320 Logic Elements, 81‑WLCSP

The LCMXO3LF-4300E-5UWG81CTR1K is a MachXO3 family field programmable gate array (FPGA) device designed for compact, low-voltage system integration. Built on the MachXO3 architecture, this device combines programmable logic, embedded memory, and hardened system IP to support control, glue-logic, and peripheral interfacing in cost- and space-constrained commercial designs.

With 4,320 logic elements, approximately 94,208 bits of embedded RAM, and 63 user I/Os in an 81‑WLCSP package (3.80 × 3.69 mm), this part targets applications requiring a small footprint, non-volatile configuration, and flexible I/O and clocking options.

Key Features

  • Logic Capacity  4,320 logic elements with 540 logic clusters provide the programmable fabric required for control, protocol bridging, and simple processing functions.
  • Embedded Memory  Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for FIFOs, buffers, and small data storage.
  • I/O and Interfaces  63 user I/Os with support for MachXO3 family I/O features including pre‑engineered source synchronous I/O and flexible on‑chip buffer options as described in the MachXO3 family documentation.
  • Non‑volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities for in-system updates.
  • Embedded Hardened IP  Family-level documentation lists hardened I2C and SPI IP cores, timer/counter functions, and other system IP to accelerate development of common peripheral interfaces.
  • Clocking and Timing  Flexible on-chip clocking with system PLLs and internal oscillators (per MachXO3 family data sheet) to support a range of timing and synchronization schemes.
  • Package and Mounting  Compact 81‑WLCSP package (3.80 × 3.69 mm) for minimal PCB area and surface-mount assembly.
  • Power and Thermal  Operates from a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C.
  • Regulatory  RoHS‑compliant material status for environmental compliance in commercial electronics.

Typical Applications

  • Embedded Controller and Glue Logic  Use the programmable fabric and embedded IP to implement control sequencing, protocol bridging, and board-level glue logic in compact systems.
  • User Interfaces and Peripheral Aggregation  Combine the I/O count and hardened SPI/I2C IP to manage displays, keypads, sensors, and peripheral buses.
  • Compact Consumer Electronics  The small 81‑WLCSP footprint and commercial temperature rating make the device suitable for space‑constrained consumer products requiring non‑volatile FPGA functionality.
  • Low‑power, Space‑constrained Designs  Low-voltage core operation and a miniature package enable integration into designs where PCB area and power are limited.

Unique Advantages

  • Compact, board‑level integration: The 81‑WLCSP (3.80 × 3.69 mm) package minimizes PCB area while preserving 63 I/Os for flexible connectivity.
  • Non‑volatile, reprogrammable logic: Multi-time programmable configuration eliminates the need for an external configuration flash in many designs and supports in-system updates.
  • Embedded system IP: Hardened I2C and SPI cores and on‑chip timer/counter functions reduce development time and external component count.
  • Flexible clocking: On‑chip PLLs and oscillators (MachXO3 family features) simplify timing architectures without additional clock chips.
  • Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation with RoHS‑compliant materials for mainstream commercial applications.
  • Low‑voltage core operation: 1.14 V to 1.26 V supply range supports designs targeting modern low‑voltage domains.

Why Choose LCMXO3LF-4300E-5UWG81CTR1K?

This MachXO3 device balances integration and compact packaging to deliver programmable logic, embedded RAM, and hardened system IP in a small surface‑mount footprint. It is well suited for engineers designing commercial-grade products that need non-volatile FPGA capabilities, flexible I/O, and integrated peripheral functions without a large board area penalty.

Choose this part for space-constrained designs that require scalable logic resources (4,320 logic elements), modest on-chip memory, and family-level features such as programmable clocking, on-chip IP cores, and reconfigurability to accelerate development and reduce BOM complexity.

Request a quote or submit a pricing inquiry to evaluate LCMXO3LF-4300E-5UWG81CTR1K for your next compact, low‑voltage FPGA design.

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