LCMXO3LF-4300E-5UWG81ITR

The LCMXO3LF-4300E-5UWG81ITR is a MachXO3 field programmable gate array (FPGA) in an 81‑WLCSP package. It provides 4,320 logic elements and approximately 0.094 Mbits (94,208 bits) of embedded RAM for control, glue-logic, and small buffering tasks in space‑constrained designs.

Designed for industrial applications, the device integrates flexible I/O and on-chip system features while operating from a 1.14 V to 1.26 V supply and across an extended temperature range of −40 °C to 100 °C. The compact 81‑WLCSP package (3.80 × 3.69 mm) and 63 available I/O pins suit dense board layouts and low-profile systems.

Key Features

• Logic Capacity — 4,320 logic elements for implementing glue logic, control state machines, and moderate-complexity programmable functions.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM for FIFOs, small frame buffers, and register storage.
• I/O — 63 programmable I/O pins to interface with sensors, buses, and peripheral devices in compact systems.
• Low-Voltage Operation — Core supply range of 1.14 V to 1.26 V to match modern low-voltage power rails.
• Industrial Temperature Grade — Specified operation from −40 °C to 100 °C for industrial environments.
• Compact Packaging — 81‑WLCSP (3.80 × 3.69 mm) surface-mount package for minimal PCB footprint and low-profile assemblies.
• Non-volatile, Multi-time Programmable Architecture — On-chip non-volatile configuration and reconfiguration options as documented in the MachXO3 family datasheet.
• Integrated System Functions — Family-level features include on-chip clocking, PLLs, on-chip oscillator, and embedded hardened IP (I²C, SPI, timer/counter, user flash memory) as described in the MachXO3 datasheet.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control — Implement control logic, protocol bridging, and signal conditioning in industrial automation equipment using the industrial temperature rating and flexible I/O.
• Embedded System Glue Logic — Replace discrete logic and microcontroller I/O expanders with programmable logic for board-level integration and design consolidation.
• Sensor and Interface Hubs — Aggregate sensor data, implement filtering or timing logic, and handle peripheral interfaces using available I/O and on-chip memory.
• User Interface Control — Drive and manage buttons, LEDs, and touch interfaces with compact implementation in a WLCSP package for small form-factor products.

Unique Advantages

• Compact, Low‑Profile Package: The 81‑WLCSP (3.80 × 3.69 mm) minimizes PCB area and enables tight mechanical integration in space-constrained designs.
• Industrial Temperature Range: Specified −40 °C to 100 °C operation provides resilience for industrial deployments.
• Balanced Integration: Combines 4,320 logic elements with on-chip RAM and embedded IP, reducing external component count and simplifying BOM.
• Low-Voltage Core: Operates from a 1.14 V to 1.26 V supply, allowing compatibility with modern low-voltage power architectures.
• Design Flexibility from MachXO3 Family Features: Family-level capabilities such as programmable I/O behavior, internal clocking and PLLs, and non-volatile configuration enable flexible system-level designs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LCMXO3LF-4300E-5UWG81ITR?

This MachXO3 FPGA offers a pragmatic balance of logic capacity, embedded memory, and system features in a tiny WLCSP footprint tailored for industrial and embedded applications. Its combination of 4,320 logic elements, ~94,208 bits of on-chip RAM, 63 I/Os, and extended temperature rating makes it suitable for designers needing a compact, programmable building block to consolidate glue logic and peripheral interfacing.

For teams focused on reducing BOM count and fitting programmable logic into constrained mechanical envelopes, this device provides an integrated, reprogrammable option backed by the MachXO3 family feature set documented in the product datasheet.

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