LCMXO3LF-4300E-5UWG81ITR50

IC FPGA 63 I/O 81WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP

Quantity 620 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package81-WLCSP (3.80x3.69)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case81-UFBGA, WLCSPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300E-5UWG81ITR50 – MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP

The LCMXO3LF-4300E-5UWG81ITR50 is a MachXO3 family FPGA IC from Lattice Semiconductor, offered in a compact 81-WLCSP package for surface-mount assembly. It delivers a non-volatile, reprogrammable logic solution with 4,320 logic elements, 63 I/Os and 94,208 bits of embedded RAM for control and glue-logic tasks in industrial designs.

Designed for industrial-grade operation, the device supports a 1.14 V to 1.26 V supply range and an operating temperature range of -40 °C to 100 °C, making it suitable for embedded systems that require small form-factor programmable logic with on-chip memory and hardened system IP from the MachXO3 family.

Key Features

  • Core Logic  4,320 logic elements providing programmable logic capacity for control, interfacing and system glue functions.
  • Embedded Memory  94,208 total RAM bits of on-chip memory for buffering, FIFOs and small data storage needs.
  • I/O and Interfaces  63 user I/Os enabling flexible connectivity to external devices and buses.
  • Configuration and Hardened IP  MachXO3 family features include non-volatile, multi-time programmable configuration and embedded hardened IP blocks (family-level functions listed in the MachXO3 data sheet).
  • Clocking and Timing  Family architecture includes flexible on-chip clocking and PLL support as documented in the MachXO3 data sheet.
  • Power  Low-voltage operation with a specified supply range of 1.14 V to 1.26 V.
  • Package and Mounting  81-WLCSP (3.80 × 3.69 mm) ultra-compact package, surface-mount mounting for space-constrained designs.
  • Temperature and Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Programmable logic and interface functions in industrial equipment where the -40 °C to 100 °C operating range and industrial grading are required.
  • Embedded System Integration  On-chip RAM and 63 I/Os allow implementation of glue logic, protocol adaptation and small bus controllers in compact embedded platforms.
  • Interface Bridging  Use as a configurable bridge or I/O expander in systems that need reprogrammable I/O mapping and logic without external non-volatile configuration memory.

Unique Advantages

  • Compact, surface-mount package: The 81-WLCSP (3.80 × 3.69 mm) package minimizes board area for space-constrained designs.
  • Industrial temperature capability: Rated from -40 °C to 100 °C to support deployments in demanding environments.
  • Integrated on-chip memory: 94,208 bits of embedded RAM reduce the need for external memory for buffering and small data storage.
  • Low-voltage operation: Narrow supply window (1.14 V to 1.26 V) that supports low-power system designs and predictable power planning.
  • Reprogrammable, non-volatile family features: MachXO3 family capabilities such as multi-time programmable configuration and embedded hardened IP enable flexible in-field updates and system integration.
  • Good I/O density for its size: 63 I/Os provide broad interfacing options relative to the package footprint.

Why Choose LCMXO3LF-4300E-5UWG81ITR50?

This MachXO3 family device combines a compact WLCSP package with a moderate logic capacity (4,320 logic elements), on-chip RAM and 63 I/Os to deliver a programmable solution optimized for industrial embedded applications. Its industrial temperature range and RoHS compliance make it a practical choice for designers who need durable, reprogrammable logic in small form factors.

The part is well suited for engineers building control, interface and integration functions where board space, reprogrammability and predictable low-voltage operation are priorities. MachXO3 family architectural features documented in the data sheet—such as on-chip clocking, hardened IP blocks and non-volatile configuration—support versatile system-level integration and future updates.

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