LCMXO3LF-4300E-6MG256I

The LCMXO3LF-4300E-6MG256I is a MachXO3 family field programmable gate array (FPGA) supplied in a 256-ball VFBGA/CSPBGA package. It provides a compact, non-volatile programmable logic solution with 4,320 logic elements, 206 general-purpose I/Os and embedded on-chip memory for control and interface functions.

Targeted at industrial temperature environments, this device combines flexible I/O, on-chip RAM and hardened peripheral IP to support designs that require reprogrammable logic, system-level integration and low-voltage operation.

Key Features

• Logic Capacity — 4,320 logic elements (as specified), suitable for glue logic, control and interface consolidation.
• Embedded Memory — 94,208 bits of on-chip RAM (approximately 0.094 Mbits) with sysMEM block support, including single, dual, pseudo-dual port and FIFO modes.
• I/O and Interface — 206 I/Os with pre‑engineered source synchronous I/O and flexible on-chip I/O buffering for diverse interface needs.
• Non‑volatile, Reprogrammable — MachXO3 family non-volatile, multi‑time programmable architecture with TransFR reconfiguration options described in the family datasheet.
• Hardened IP — Embedded hardened functions referenced in the MachXO3 datasheet, including I²C, SPI and timer/counter cores to reduce external component count.
• Clocking and Oscillator — Flexible on-chip clocking including PLLs and an on-chip oscillator as outlined in the MachXO3 family documentation.
• Power and Modes — Supports standby mode and power saving options documented for the MachXO3 family; nominal supply range 1.14 V to 1.26 V.
• Package & Mounting — 256-ball VFBGA / 256-CSFBGA (9×9) package for surface-mount PCB assembly.
• Operating Range & Compliance — Industrial operating temperature range −40 °C to 100 °C and RoHS compliant.

Unique Advantages

• High integration in a compact package: 4,320 logic elements and 206 I/Os in a 256-ball BGA enable consolidation of multiple discrete functions into a single device footprint.
• Non-volatile, field reprogrammability: Multi-time programmable MachXO3 architecture allows in-field updates without external configuration memory.
• On-chip memory flexibility: Approximately 0.094 Mbits of embedded RAM with support for multiple memory modes (including FIFO) simplifies buffer and small-data storage designs.
• Industrial-ready temperature range: Rated from −40 °C to 100 °C to support a wide range of industrial applications and environments.
• Low-voltage operation: Narrow supply range (1.14 V to 1.26 V) supports integration with modern low-voltage power domains.
• Reduced BOM via hardened IP: Built-in I²C, SPI and timer/counter hard IP blocks (per family datasheet) reduce the need for external peripherals and simplify firmware.

Why Choose LCMXO3LF-4300E-6MG256I?

The LCMXO3LF-4300E-6MG256I delivers a balanced combination of reprogrammable logic capacity, embedded memory and a high I/O count in a compact 256-ball BGA package. Its MachXO3 family features—non‑volatile multi‑time programmability, hardened peripheral IP, flexible on‑chip clocking and power-saving modes—make it suitable for industrial designs that require reliable, field-updatable logic with a small PCB footprint.

Designers seeking to consolidate interface logic, implement control and glue logic, or replace multiple discrete components with a single programmable device will find this part aligns to those objectives while operating across a wide industrial temperature range and adhering to RoHS requirements.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the LCMXO3LF-4300E-6MG256I. Representatives can provide lead-time details and procurement options.