LCMXO3LF-4300E-6MG256C

IC FPGA 206 I/O 256CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-VFBGA, CSPBGA

Quantity 680 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (9x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-VFBGA, CSPBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300E-6MG256C – MachXO3 Field Programmable Gate Array, 256-VFBGA

The LCMXO3LF-4300E-6MG256C is a MachXO3 family FPGA in a compact 256-VFBGA (CSPBGA) package targeted for commercial applications. It provides a mid-density programmable fabric with 4,320 logic elements, roughly 94 Kbits of embedded RAM, and up to 206 general-purpose I/Os.

Designed for system control, interface bridging and glue-logic roles, the device combines non-volatile, multi-time programmable configuration with on-chip clocking, embedded hardened IP and flexible I/O capabilities as documented in the MachXO3 family datasheet.

Key Features

  • Programmable Logic 4,320 logic elements to implement glue logic, control state machines and moderate-density custom logic functions.
  • Embedded Memory Approximately 94 Kbits (94,208 bits) of on-chip RAM for FIFOs, small buffers and local data storage.
  • I/O Capacity & Flexibility Up to 206 I/Os delivered from the 256-VFBGA (256-CSFBGA, 9×9) package for rich connectivity to external peripherals and buses.
  • Power and Supply Operates from a 1.14 V to 1.26 V core supply range as specified in the product data.
  • Non-volatile Configuration MachXO3 family features include non-volatile, multi-time programmable configuration memory to retain device configuration as documented in the datasheet.
  • On-chip System Features (Datasheet) Family-level documentation describes flexible on-chip clocking including PLLs, an on-chip oscillator, programmable I/O cells, and embedded hardened IP blocks such as I²C and SPI cores and timer/counter functions.
  • Packaging & Mounting Surface-mount 256-VFBGA (CSPBGA) package, supplier device package listed as 256-CSFBGA (9×9), suitable for compact board implementations.
  • Commercial Grade & Compliance Commercial operating grade with RoHS compliance and operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Interface Bridging and Protocol Translation Use the device’s logic capacity and embedded IP cores for bridging between peripherals, buses and legacy interfaces.
  • System Control and Glue Logic Implement power sequencing, reset control, and system state machines with available logic elements and on-chip timers.
  • I/O Expansion and Board-Level Integration High I/O count supports dense board-level I/O routing, signal conditioning and aggregation for peripherals and sensors.
  • Embedded Peripheral Offload Offload lightweight serial control and timing tasks using hardened I²C/SPI IP and timer/counter resources documented for the MachXO3 family.

Unique Advantages

  • Balanced Logic and Memory: 4,320 logic elements paired with approximately 94 Kbits of embedded RAM provide an efficient mix for control and buffering tasks.
  • High I/O Density in a Compact Package: 206 I/Os in a 256-VFBGA (9×9) CSPBGA footprint simplifies designs that require many external connections without a large package.
  • Non-volatile, Reprogrammable Configuration: Multi-time programmable, non-volatile configuration supports field updates and design iterations without external configuration memory (feature documented in the MachXO3 datasheet).
  • On-chip System Support: Family documentation lists system-level features such as PLLs, on-chip oscillator, programmable I/O cells and embedded IP (I²C, SPI, timers) to reduce external component count.
  • Commercial Grade and RoHS Compliant: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance for standard commercial product deployments.
  • Surface-Mount, Industry-Standard Package: 256-CSFBGA (9×9) supplier package supports common manufacturing and PCB layout practices.

Why Choose LCMXO3LF-4300E-6MG256C?

The LCMXO3LF-4300E-6MG256C positions itself as a practical, mid-density FPGA choice for designers needing substantial I/O, non-volatile configurability and integrated system features in a compact surface-mount package. Its combination of 4,320 logic elements, roughly 94 Kbits of embedded RAM and hardened peripheral IP (as documented in the MachXO3 family datasheet) makes it well suited for board-level control, interface bridging and I/O consolidation tasks in commercial products.

Designed for engineers who require reprogrammable on-board logic with retained configuration and system-level support, this MachXO3 device provides a clear balance of integration, connectivity and documented family features to support a variety of embedded designs.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the LCMXO3LF-4300E-6MG256C.

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