LCMXO3LF-4300E-6MG324I

IC FPGA 268 I/O 324CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 268 94208 4320 324-VFBGA

Quantity 1,212 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSFBGA (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-VFBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300E-6MG324I – MachXO3 FPGA, 268 I/O, 4320 logic elements, 324-VFBGA

The LCMXO3LF-4300E-6MG324I is a MachXO3 family field programmable gate array (FPGA) in a 324-VFBGA package designed for industrial applications. It provides a flexible, non-volatile FPGA architecture with integrated on-chip resources and a broad I/O complement for system glue logic, protocol bridging, and embedded control tasks.

Key on-die resources include 4,320 logic elements, approximately 0.094 Mbits of embedded RAM (94,208 bits), 268 I/O pins, and a range of hardened IP and system features described in the MachXO3 family data sheet. The device supports a 1.14 V to 1.26 V core supply and an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

  • Logic Capacity  4,320 logic elements provide a compact programmable fabric for glue logic, state machines, and control functions.
  • Embedded Memory  Approximately 94,208 bits (≈0.094 Mbits) of on-chip RAM for FIFOs, small buffers, and temporary data storage.
  • I/O and Interfaces  268 I/O pins with the MachXO3 family’s flexible I/O buffer architecture and pre‑engineered source‑synchronous I/O support described in the datasheet.
  • Non-volatile, Multi-time Programmable  MachXO3 family features include non-volatile, multi-time programmable configuration for persistent system behavior without external configuration memory.
  • Hardened IP and System Blocks  Family-level resources include embedded hardened IP such as I²C and SPI cores, timer/counter, on-chip oscillator, PLLs, and user flash memory (UFM) as documented in the MachXO3 data sheet.
  • Power and Configuration  Standby and power saving options, TransFR reconfiguration, and IEEE 1149.1-compliant boundary scan testability are included in the family specification.
  • Package and Mounting  324-VFBGA (supplier device package: 324-CSFBGA, 10 × 10), surface-mount package suitable for high-density PCB layouts.
  • Industrial Grade and Environmental  Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Core Supply  Core voltage range: 1.14 V to 1.26 V.

Typical Applications

  • Industrial Control and Automation  Use as system glue logic, protocol bridging, or local control where industrial temperature rating and persistent configuration are required.
  • Interface and Protocol Bridging  Flexible I/O buffering and embedded SPI/I²C IP support protocol translation and bus interfacing tasks between subsystems.
  • Embedded System Glue Logic  Implement state machines, reset and clock control, or peripheral aggregation using on-chip logic and RAM.
  • Test, Prototyping, and Production Support  Boundary-scan testability and non-volatile configuration simplify board-level validation and field updates.

Unique Advantages

  • Non-volatile Configuration: Persistent, multi-time programmable configuration removes the need for external configuration memory in many designs.
  • Compact, Integrated Resource Set: Combines 4,320 logic elements, embedded RAM, hardened IP, and extensive I/O in a single 324‑VFBGA package to reduce BOM and board area.
  • Industrial Reliability: Specified for −40 °C to 100 °C operation and RoHS compliant, supporting deployment in industrial environments.
  • Flexible I/O and Clocking: Family-level support for flexible on-chip clocking, PLLs, and source-synchronous I/O helps simplify high-performance interface implementation.
  • Built-in System Functions: Hardened I²C/SPI cores, timers/counters, UFM, oscillator, and configuration features reduce integration effort and accelerate time-to-market.

Why Choose LCMXO3LF-4300E-6MG324I?

The LCMXO3LF-4300E-6MG324I delivers a balanced mix of programmable logic, embedded memory, extensive I/O, and hardened system IP within a compact industrial-grade package. It is suited for designs that need persistent configuration, flexible interfacing, and integrated system functions while minimizing external components.

Engineers targeting industrial control, interface bridging, and embedded system glue logic will find the device’s combination of 4,320 logic elements, roughly 0.094 Mbits of on-chip RAM, and 268 I/O pins useful for scalable, reliable designs. The MachXO3 family features documented in the datasheet support configuration flexibility, power management, and on-chip peripherals that help reduce design complexity and long-term maintenance.

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