LCMXO3LF-640E-6MG121I

The LCMXO3LF-640E-6MG121I is a MachXO3 family FPGA offering a flexible, non-volatile programmable fabric optimized for system control, I/O interfacing, and glue-logic tasks. This industrial-grade device combines 640 logic elements, 65,536 bits of embedded RAM, and up to 100 programmable I/Os in a compact 121-VFBGA (6×6) surface-mount package.

Designed for applications that require on-chip configuration, mixed I/O capabilities, and power management options, the MachXO3 architecture provides configurable routing, on-chip clocking (including PLLs), and a range of embedded hardened IP blocks to accelerate system development.

Key Features

• Core Logic  640 logic elements provide the programmable fabric for glue logic, control functions, and small-scale custom logic implementations.
• Embedded Memory  65,536 bits of on-chip RAM (sysMEM) supporting single, dual, pseudo-dual port and FIFO modes for flexible local buffering and state storage.
• I/O Capacity & Flexibility  Up to 100 I/Os with a high-performance, flexible I/O buffer and pre‑engineered source‑synchronous I/O support to simplify peripheral and interface connections.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family non-volatile configuration enables multi-time programming and TransFR reconfiguration options for in-system updates without relying on external configuration flash.
• Clocking & Timing  Integrated clocking resources including sysCLOCK Phase Locked Loops (PLLs) for design-grade clock management and timing flexibility.
• Embedded Hardened IP  Hardened IP functions include I²C and SPI cores, timers/counters, and user flash memory (UFM) to reduce design effort and BOM count.
• Power Management  Standby mode and other power-saving options enable lower-power operation when full functionality is not required.
• Package, Power & Mounting  121-VFBGA (CSPBGA) 6×6 package, surface-mount mounting; recommended supply voltage range 1.14 V to 1.26 V.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Design & Testability  Family documentation describes IEEE 1149.1-compliant boundary-scan testability and configuration/testing features for manufacturing and validation.

Typical Applications

• Interface Bridging and I/O Expansion  Use the 100 programmable I/Os and flexible I/O buffers to implement protocol bridging, bus translation, and peripheral aggregation.
• System Glue Logic  Implement control state machines, address decoding, and timing adjustment functions using the device’s 640 logic elements and embedded RAM.
• Embedded Control and Monitoring  Leverage the hardened timers/counters, I²C and SPI cores, and on-chip UFM for compact system-control and monitoring functions without external controllers.
• Industrial Automation  Industrial temperature rating and robust I/O support suit the device for factory automation, instrumentation interfaces, and control-panel logic.

Unique Advantages

• Non-volatile configuration  Eliminates the need for external configuration flash by enabling multi-time programmable, on-chip configuration storage.
• Integrated hardened IP  Built-in I²C, SPI and timer/counter blocks reduce development time and spare board space compared with discrete IP implementations.
• Compact package for space-constrained designs  The 121-VFBGA (6×6) CSPBGA package delivers a small footprint for embedded and compact system boards.
• Industrial-grade operation  −40 °C to 100 °C temperature range and industrial grade classification support deployment in demanding environments.
• Flexible clocking and I/O  On-chip PLLs and pre-engineered source-synchronous I/O simplify timing design and high-speed interface integration.
• Power-aware modes  Standby and other power-saving options allow designers to optimize power consumption for battery-backed or energy-sensitive systems.

Why Choose LCMXO3LF-640E-6MG121I?

The LCMXO3LF-640E-6MG121I positions itself as a compact, industrial-grade MachXO3 FPGA suited for system glue logic, I/O expansion, and embedded control tasks. With 640 logic elements, 65,536 bits of embedded RAM, and 100 programmable I/Os in a 121-VFBGA package, it balances integration and footprint for space- and power-constrained designs.

Its non-volatile, multi-time programmable configuration, integrated hardened IP (I²C, SPI, timers), and on-chip clocking resources provide a pragmatic platform for shortening development time while supporting robust operation in industrial environments. The device is appropriate for designers seeking a small, configurable FPGA fabric with built-in system-level features and power-management options.

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