LCMXO3LF-6900C-5BG324C

The LCMXO3LF-6900C-5BG324C is a MachXO3 family FPGA IC offering 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and a high-count I/O array with 279 I/Os. It combines the MachXO3 family architecture and on-chip resources to address system control, interface bridging, and glue-logic roles in commercial-grade electronic designs.

Designed for surface-mount deployment in a 324-LFBGA (324-CABGA, 15×15) package, the device operates from a 2.375 V to 3.465 V supply and across a commercial temperature range of 0 °C to 85 °C, with RoHS compliance for environmental conformance.

Key Features

• Core Capacity — 6,864 logic elements provide flexible programmable logic for control, glue logic, and interface functions.
• Embedded Memory — 245,760 bits of on-chip RAM (approximately 0.246 Mbits) for FIFOs, buffering, and small data stores.
• High I/O Count — 279 programmable I/Os to support dense peripheral interfacing, bus bridging, and multi-signal designs.
• Flexible I/O and Clocking — MachXO3 family features include flexible I/O buffering and on-chip clock resources such as PLLs for system timing and source-synchronous interfaces.
• Embedded Hardened IP — Family-level hardened IP blocks referenced in the MachXO3 data include I²C, SPI, and timer/counter functions to accelerate common peripheral tasks.
• Non‑volatile, Multi‑time Programmable Configuration — Family configuration options include non-volatile, multi-time programmable storage and TransFR reconfiguration support as described in the MachXO3 documentation.
• Package & Mounting — 324-LFBGA (324-CABGA, 15×15) surface-mount package suitable for compact board layouts.
• Power and Temperature — Supply range 2.375 V to 3.465 V and commercial operating range 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Interface and I/O Bridging — Use the device’s 279 I/Os and programmable logic to implement bus bridging, protocol translation, and parallel-to-serial interfaces.
• System Control and Glue Logic — Implement control sequencers, reset logic, and board-level state machines using the available logic elements and on-chip memory.
• Peripheral Management — Offload peripheral timing, SPI/I²C handling, and local buffering using embedded hardened IP and block RAM.
• Configuration and Boot Support — Leverage the MachXO3 family’s non-volatile, multi-time programmable configuration to manage device startup and in-field updates.

Unique Advantages

• High I/O Density: 279 I/Os enable direct connection to multiple peripherals and buses, reducing external interface components.
• Balanced Logic and Memory: 6,864 logic elements paired with approximately 0.246 Mbits of embedded RAM support mid-range control and buffering tasks without external SRAM.
• Integrated Peripheral IP: Hardened I²C, SPI, and timer/counter functions simplify common interface implementations and speed development.
• Non‑volatile Configuration: Multi-time programmable, non-volatile configuration options provide flexible deployment and in-field reconfiguration strategies.
• Commercial Package and Mounting: 324-LFBGA (15×15) surface-mount package offers a compact footprint for space-constrained PCBs.
• Wide Supply Range: Operation across 2.375 V to 3.465 V supports a variety of system power architectures.

Why Choose LCMXO3LF-6900C-5BG324C?

The LCMXO3LF-6900C-5BG324C positions itself as a versatile MachXO3 family FPGA for commercial designs needing a balance of logic capacity, substantial I/O, and embedded memory. Its on-chip hardened peripherals and family configuration features reduce external component count and simplify common system functions.

This device is well suited to engineers designing mid-density control, interface, and peripheral-management solutions who require a compact 324-LFBGA package, commercial temperature operation, and RoHS compliance. The MachXO3 family documentation provides detailed architecture and configuration options to support integration into production systems.

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