LCMXO3LF-6900C-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 97 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3LF-6900C-6BG256C – MachXO3 Field Programmable Gate Array, 6864 logic elements, 245760-bit RAM, 206 I/O, 256-LFBGA

The LCMXO3LF-6900C-6BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded designs. It provides a non-volatile, multi-time programmable architecture with on-chip resources for control, glue logic, and interface functions.

With 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and 206 user I/O pins in a 256-ball LFBGA package, the device targets applications that need flexible I/O, on-chip peripherals and compact surface-mount packaging.

Key Features

  • Core Density — 6,864 logic elements suitable for mid-range programmable logic tasks and control functions.
  • Embedded Memory — Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for small data buffers, state storage, and microarchitectural memory blocks.
  • I/O Capability — 206 user I/O pins to support broad interfacing and peripheral connections from a single device.
  • Non-volatile, Multi-time Programmable — MachXO3 family non-volatile configuration for retained programming and field reconfiguration.
  • On-chip Peripherals and Hardened IP — Includes embedded hardened IP functions and system features referenced in the MachXO3 family data (for example: I2C, SPI, timers/counters, on-chip oscillator and user flash memory as described in the datasheet).
  • Clocking and Memory Blocks — Flexible on-chip clocking elements and embedded block RAM (sysMEM) options described in the MachXO3 family architecture.
  • Power and Mounting — Surface mount device with recommended supply voltage range of 2.375 V to 3.465 V and commercial-grade operation.
  • Package — 256-ball LFBGA; supplier package referenced as 256-CABGA (14×14), enabling compact board-level integration.
  • Operating Temperature & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Interface and I/O Expansion — Use the device’s 206 I/O pins and flexible I/O buffers to consolidate multiple peripheral interfaces and perform board-level protocol bridging.
  • Glue Logic and System Control — Deploy the 6,864 logic elements and embedded memory to implement glue logic, state machines, and control functions in compact systems.
  • Peripheral Subsystems — Implement peripheral controllers, simple protocol handlers or timers using the MachXO3 family’s hardened IP and on-chip resources.

Unique Advantages

  • Compact, Surface-Mount Integration: 256-ball LFBGA package (14×14 supplier package) delivers a low-footprint programmable solution for space-constrained PCBs.
  • Flexible Voltage Range: 2.375 V to 3.465 V supply range supports a variety of board power architectures and interfacing scenarios.
  • Non-volatile Configuration: Multi-time programmable, non-volatile configuration enables field updates without external configuration memory.
  • Embedded Hardened Functions: On-chip hardened IP and system features reduce the need for discrete peripherals and simplify BOM.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match general-purpose commercial applications and designs.
  • Standards and Compliance: RoHS-compliant construction supports modern environmental and manufacturing requirements.

Why Choose LCMXO3LF-6900C-6BG256C?

The LCMXO3LF-6900C-6BG256C positions itself as a versatile, mid-density MachXO3 FPGA option for designers who need a compact, non-volatile programmable device with substantial I/O and embedded memory. Its combination of 6,864 logic elements, approximately 0.246 Mbits of RAM, and 206 I/O pins provides the integration needed to replace discrete logic and consolidate subsystem functions.

Engineers seeking a commercially rated, RoHS-compliant FPGA with on-chip peripherals and flexible power support will find this part suitable for a wide range of control, interfacing, and subsystem tasks. The MachXO3 family architecture and embedded hardened IP referenced in the datasheet help simplify design partitioning and reduce external component count, supporting long-term product scalability and maintainability.

Request a quote or submit an inquiry for the LCMXO3LF-6900C-6BG256C to obtain pricing and availability information for your design requirements.

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