LCMXO3LF-6900C-6BG256I

The LCMXO3LF-6900C-6BG256I is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It combines reprogrammable logic, embedded memory, and flexible I/O in a compact 256-ball LFBGA package for industrial designs.

Designed for system control, I/O management and configuration tasks in industrial environments, this device delivers 6,864 logic elements, approximately 245,760 bits of on-chip RAM, and 206 user I/Os, supporting a broad set of embedded IP and on-chip clocking options.

Key Features

• Core Capacity — 6,864 logic elements provide programmable logic resources for glue logic, control functions and moderate-density FPGA designs.
• Embedded Memory — Approximately 245,760 bits of sysMEM embedded block RAM to support data buffering, FIFOs and local storage.
• I/O and Interfaces — 206 user I/Os with flexible sysI/O buffering and support for pre-engineered source-synchronous I/O configurations as described in the MachXO3 family documentation.
• Non-volatile Configuration — Non-volatile, multi-time programmable architecture enables in-system reconfiguration and persistent device configuration.
• Embedded Hardened IP — Includes hardened IP building blocks referenced in the MachXO3 datasheet (Hardened I²C, SPI, timer/counter and User Flash Memory (UFM)).
• Clocking and Timing — Flexible on-chip clocking including sysCLOCK Phase Locked Loops (PLLs) and an on-chip oscillator for system clock generation and distribution.
• Packaging & Mounting — 256-LFBGA package (supplier designation 256-CABGA, 14×14) with surface-mount mounting for compact board-level integration.
• Industrial Operating Range — Rated for industrial temperature operation from −40 °C to 100 °C and a supply voltage range of 2.375 V to 3.465 V.
• System Support & Testability — MachXO3 family features for configuration, boundary-scan testability and TraceID are documented in the datasheet to support development and manufacturing test flows.
• RoHS Compliant — Device meets RoHS environmental compliance requirements.

Typical Applications

• Industrial Control and Automation — Reprogrammable logic and the −40 °C to 100 °C operating range make the device suitable for control, signaling and interface tasks in industrial equipment.
• Interface Bridging and I/O Expansion — High I/O count (206 pins) and flexible sysI/O buffering enable protocol bridging, level translation and expanded peripheral connectivity.
• Embedded System Glue Logic — Use the logic elements and embedded memory for glue logic, configuration management and system glue functions in embedded designs.
• Configuration and On-Board Management — Non-volatile, multi-time programmable configuration and on-chip UFM support device-level configuration storage and management.

Unique Advantages

• Compact, Integrated Solution: Combines 6,864 logic elements, embedded RAM and 206 I/Os in a single 256-LFBGA package to reduce board-level component count.
• Industrial Readiness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount 14×14 package for industrial applications.
• Flexible Power Range: Operates across a wide supply window (2.375 V to 3.465 V), giving flexibility for mixed-voltage system designs.
• On-Chip System Blocks: Built-in PLLs, on-chip oscillator, hardened I²C/SPI/timer IP and user flash memory simplify system design and reduce external BOM.
• Reconfigurable Non-Volatile Architecture: Multi-time programmable non-volatile configuration enables field updates and iterative development without external configuration memory.
• Manufacturing and Test Support: Family-level features for device configuration, boundary-scan testability and trace functions streamline production test and validation.

Why Choose LCMXO3LF-6900C-6BG256I?

The LCMXO3LF-6900C-6BG256I delivers a balanced mix of programmable logic capacity, embedded memory and abundant I/O in a compact industrial-grade package. Its non-volatile, multi-time programmable architecture and integrated system blocks (PLLs, oscillator, hardened IP and UFM) make it a practical choice for engineers building industrial control, interface or embedded management functions that require reprogrammable logic and on-chip resources.

This part is well suited to designs that need a compact, surface-mount FPGA solution with documented family-level features for configuration, clocking and test. The device’s operating temperature range and RoHS compliance add practical value for long-term deployment in industrial settings.

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