LCMXO3LF-6900C-6BG400C

The LCMXO3LF-6900C-6BG400C is a MachXO3 family Field Programmable Gate Array (FPGA) IC providing a flexible, non-volatile programmable fabric for system-level integration. With 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and up to 335 user I/Os in a 400-LFBGA package, this device targets designs that require mid-density programmable logic, extensive I/O and integrated system functions.

Built with features from the MachXO3 family — including flexible architecture, on-chip clocking and hardened peripheral IP — the device is suited for designs that need programmable glue logic, I/O and interface control, and non-volatile configuration in a surface-mount 400-CABGA (17×17) package.

Key Features

• Logic Capacity  6,864 logic elements for mid-density programmable logic and glue logic tasks.
• Embedded Memory  Approximately 0.246 Mbits of on-chip RAM (245,760 bits) supporting ROM/RAM modes, FIFO and memory-cascading configurations as described in the MachXO3 family architecture.
• I/O Density and Flexibility  Up to 335 user I/Os with pre-engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture.
• Configuration and Reconfiguration  Non-volatile, multi-time programmable configuration memory with TransFR reconfiguration capabilities for in-system updates and flexible device programming.
• Clocking and Timing  Flexible on-chip clocking including sysCLOCK PLLs and clock distribution network to support a variety of clocking topologies.
• Embedded Hardened IP  Integrated hardened IP functions such as I²C, SPI and timer/counter blocks, on-chip oscillator and user flash memory (UFM) for system-level functions.
• Power and Reliability Features  Standby modes and power-saving options plus power-on-reset and configuration/test capabilities as part of the MachXO3 family feature set.
• Packaging and Environmental  Surface-mount 400-LFBGA (supplier package: 400-CABGA, 17×17), commercial grade with RoHS compliance. Recommended operating supply voltage range: 2.375 V to 3.465 V and operating temperature 0 °C to 85 °C.

Typical Applications

• Interface and I/O Bridging  Use the high I/O count and flexible I/O buffering to implement protocol bridging, parallel/serial interface conversion and board-level glue logic.
• System Control and Initialization  Non-volatile, multi-time programmable configuration plus on-chip UFM support system-level configuration, boot-time control and managed reconfiguration.
• Embedded Peripherals Integration  Hardened I²C, SPI and timer/counter blocks enable integration of peripheral management and timing functions without external controllers.

Unique Advantages

• Mid-density logic with generous I/O: 6,864 logic elements combined with 335 I/Os delivers a balance of programmable resources and connectivity for complex glue and interface tasks.
• Non-volatile, field-updateable configuration: Multi-time programmable configuration and TransFR reconfiguration allow in-system updates and flexible product lifecycle management.
• On-chip system IP: Hardened I²C, SPI, timers and oscillator reduce external component count and simplify board-level design.
• Flexible clocking and memory modes: Integrated PLLs, clock distribution and versatile embedded memory modes (single/dual-port, FIFO) support diverse timing and buffering requirements.
• Compact, manufacturable package: Surface-mount 400-LFBGA (400-CABGA, 17×17) offers high pin count in a packaged footprint suitable for automated assembly.
• Regulatory and commercial readiness: Commercial grade device with RoHS compliance and defined operating voltage and temperature ranges for standard embedded applications.

Why Choose LCMXO3LF-6900C-6BG400C?

The LCMXO3LF-6900C-6BG400C is positioned for designers who need a mid-density, non-volatile FPGA with substantial I/O and integrated system functions. Its combination of 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, hardened peripheral IP and flexible clocking makes it well suited for consolidating glue logic, interface control and peripheral management into a single programmable device.

For teams prioritizing in-system programmability, package density and embedded system-level features in a commercially graded, RoHS-compliant device, this MachXO3 part provides a compact, upgradeable platform aligned with the MachXO3 family capabilities detailed in the datasheet.

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