LCMXO3LF-6900E-5MG324C

IC FPGA 281 I/O 324CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 281 245760 6864 324-VFBGA

Quantity 1,984 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSFBGA (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-VFBGANumber of I/O281Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3LF-6900E-5MG324C – MachXO3 FPGA, 6864 logic elements, 281 I/Os, 324‑VFBGA

The LCMXO3LF-6900E-5MG324C is a MachXO3 family field-programmable gate array (FPGA) provided in a 324‑VFBGA package for surface-mount applications. It delivers a mid-range logic capacity with flexible on-chip resources and a broad I/O complement suitable for embedded control, interface bridging and system glue logic.

Designed for commercial-grade applications, the device combines non-volatile multi-time programmable configuration with embedded memory, hardened peripheral IP, and on-chip clocking and power management features to support system-level integration and in-field reconfiguration.

Key Features

  • Logic Capacity — 6864 logic elements for implementing combinational and sequential logic, state machines and moderate-density custom accelerators.
  • Embedded Memory — 245,760 bits of on-chip RAM (approximately 0.246 Mbits) to support FIFOs, buffering and small data structures without external RAM.
  • I/O Resources — 281 user I/Os to handle multiple peripheral interfaces, bus bridges and high pin-count designs.
  • Package & Mounting — 324‑VFBGA (supplier package: 324‑CSFBGA, 10×10) in a surface-mount form factor for compact board layouts.
  • Power Supply & Temperature — Core supply operating range from 1.14 V to 1.26 V and commercial operating temperature 0 °C to 85 °C, suitable for standard commercial electronic systems.
  • Non-volatile Configuration — MachXO3 family capability for non-volatile, multi-time programmable configuration and TransFR reconfiguration for field updates and system flexibility.
  • On-chip System IP — Family-level documentation lists embedded hardened IP including I2C, SPI and timer/counter blocks, plus on-chip oscillator and user flash memory (UFM) to streamline common system functions.
  • System and Power Management — Standby mode and power-saving options, Power On Reset and configuration controls described in family datasheet for predictable system bring-up and power sequencing.
  • Design-for-Test and Configuration — IEEE 1149.1-compliant boundary scan testability and multiple configuration and testing features referenced in the product family documentation.
  • Compliance — RoHS compliant.

Typical Applications

  • Interface Bridging and Protocol Conversion — High I/O count and embedded memory enable bridging between different peripheral buses and adapting legacy interfaces.
  • Embedded Control and Glue Logic — Logic capacity and on-chip peripherals support centralized control, sequencers and board-level glue without large external logic arrays.
  • Peripheral Aggregation and I/O Expansion — 281 I/Os allow aggregation of multiple sensors, actuators or user-interface signals into a single programmable device.
  • In-field Reconfigurable Systems — Non-volatile, multi-time programmable configuration and TransFR reconfiguration enable firmware updates and in-field feature changes.

Unique Advantages

  • Highly integrated mid-range FPGA: 6864 logic elements combined with on-chip memory and hardened IP reduce the need for multiple discrete components.
  • Large I/O complement: 281 user I/Os provide flexibility to implement complex multi‑interface systems and minimize external multiplexing.
  • Non-volatile configuration: Multi-time programmable, non-volatile configuration simplifies deployment and supports field updates without external configuration flash.
  • Family-level system features: On-chip oscillator, PLLs, UFM and power/standby options described in the MachXO3 family datasheet enable compact, self-contained designs.
  • Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliant, suitable for standard commercial electronics and embedded products.

Why Choose LCMXO3LF-6900E-5MG324C?

The LCMXO3LF-6900E-5MG324C positions itself as a practical, mid-range MachXO3 family FPGA that balances logic capacity, on-chip memory and an extensive I/O set in a compact 324‑VFBGA surface-mount package. Its non-volatile configuration, embedded system IP and power-management features make it appropriate for designs that require reliable in-field updates, interface consolidation and reduced external component count.

This device is well suited to design teams building commercial embedded systems who need predictable electrical characteristics (1.14–1.26 V core supply), a large number of I/Os, and family-level resources documented in the MachXO3 datasheet to accelerate integration and testing.

Request a quote or submit a pricing inquiry to evaluate LCMXO3LF-6900E-5MG324C for your next design project.

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