LCMXO3LF-6900E-5MG324I

The LCMXO3LF-6900E-5MG324I is a MachXO3 family field programmable gate array (FPGA) offered in a 324‑VFBGA package. It integrates 6,864 logic elements with on-chip embedded memory and a high I/O count to support flexible system-level integration in industrial designs. With a non-volatile, multi-time programmable architecture described in the MachXO3 family data sheet, this device is positioned for use where compact programmable logic, rich I/O capability, and industrial temperature range are required.

Key Features

• Core Logic  6,864 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  245,760 bits of on-chip RAM (approximately 0.246 Mbits) for buffering, FIFOs, and small data storage.
• High I/O Density  281 I/O pins to support diverse peripheral interfaces and board-level connectivity.
• Non‑volatile, Reprogrammable  MachXO3 family features include non-volatile, multi-time programmable configuration for field updates and persistent configuration.
• Embedded Hardened IP  Family-level documentation lists hardened peripheral IP such as I²C and SPI cores and timer/counter functions for common system tasks.
• Flexible Clocking  Family architecture provides on-chip clocking resources (PLLs and flexible distribution) to support synchronous designs.
• Power and Voltage  Operates from a core supply range of 1.14 V to 1.26 V.
• Package and Mounting  324‑VFBGA package (supplier package: 324‑CSFBGA, 10×10) designed for surface‑mount assembly.
• Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant  Device meets RoHS environmental compliance.

Typical Applications

• System Glue Logic  Implement board-level interfacing and protocol bridging using the device’s logic fabric and abundant I/O.
• Embedded Control  Use the integrated logic and on-chip memory for control sequencing, timers, and small state machines in industrial systems.
• Interface and Peripheral Integration  Hardened I²C/SPI IP and flexible I/O support enable integration of sensors, configuration peripherals, and local buses.

Unique Advantages

• High integration in a compact package: 6,864 logic elements and 281 I/O in a 324‑VFBGA reduce board area and BOM count.
• Non‑volatile configuration: Multi-time programmable, non-volatile configuration avoids the need for external volatile configuration memory.
• Industrial temperature support: −40 °C to 100 °C operating range suits a wide range of industrial applications.
• Embedded peripheral IP: Hardened I²C, SPI, and timer/counter functions simplify implementing common system interfaces.
• Deterministic power envelope: Defined core supply range (1.14 V–1.26 V) aids predictable power budgeting and design.
• RoHS compliance: Meets environmental requirements for lead‑free assemblies.

Why Choose LCMXO3LF-6900E-5MG324I?

The LCMXO3LF-6900E-5MG324I combines a mid-range logic capacity with substantial I/O and embedded memory in a compact 324‑VFBGA surface‑mount package, making it suitable for industrial applications that require programmable system logic, persistent configuration, and integrated peripheral support. Its specified core voltage range and industrial temperature rating provide a clear electrical and environmental envelope for reliable deployment.

Designed around the MachXO3 family architecture, this device benefits from family-level features such as flexible on‑chip clocking, hardened peripheral IP, and non‑volatile reprogrammability—qualities that help reduce external components and simplify system integration for engineers and purchasing teams.

Request a quote or submit a sales inquiry to obtain pricing and availability for the LCMXO3LF-6900E-5MG324I.