LCMXO3LF-6900E-6MG324I

The LCMXO3LF-6900E-6MG324I is a MachXO3 family FPGA in a 324-VFBGA package designed for industrial applications. It delivers a flexible, non-volatile programmable fabric with on-chip embedded memory and hardened IP, enabling interface adaptation, glue logic and system-level functions in constrained board footprints.

Built around a flexible architecture with pre-engineered source-synchronous I/O and hardened peripherals, this device targets designs that require reprogrammable logic, significant I/O count and reliable operation across an industrial temperature range.

Key Features

• Core Logic: 6,864 logic elements provide reprogrammable fabric for glue logic, state machines and custom control functions.
• Embedded Memory: Approximately 0.246 Mbits of embedded RAM (245,760 total bits) with support for single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 family documentation.
• I/O and Interface Flexibility: Up to 281 I/O pins with pre-engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture to support diverse signaling requirements.
• Hardened IP and System Support: On-chip hardened IP functions including I2C, SPI and timer/counter blocks, plus user flash memory (UFM) and TransFR reconfiguration options referenced in the family datasheet.
• Power and Configuration: Core supply range 1.14 V to 1.26 V and multi-time programmable, non-volatile configuration for in-system updates; standby mode and power saving options are included in the MachXO3 family feature set.
• Package and Mounting: 324-VFBGA surface-mount package (supplier package: 324-CSFBGA, 10×10) suitable for compact board layouts.
• Industrial Temperature Range: Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Compliance: RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Adaptation: Flexible I/O and hardened SPI/I2C IP enable protocol conversion and interface bridging between disparate subsystems.
• System Glue Logic and Control: Reprogrammable logic elements are ideal for glue logic, control sequencing and board-level state machines in industrial systems.
• On-chip Buffering and FIFO Management: Embedded RAM with FIFO and multi-port modes supports buffering, data staging and temporary storage for streaming interfaces.
• Timing-Critical I/O Handling: Pre-engineered source-synchronous I/O and flexible clocking options support designs that require precise timing and synchronized data capture.

Unique Advantages

• Highly Configurable Logic: 6,864 logic elements allow designers to implement a broad range of custom functions without changing hardware.
• Significant I/O Density: 281 I/O pins reduce the need for external multiplexers or additional interface ICs, simplifying board-level design.
• Non-volatile, Reprogrammable: Multi-time programmable, non-volatile configuration supports field updates and iterative development cycles.
• Integrated System IP: Hardened I2C, SPI and timer/counter blocks lower software/firmware overhead and reduce BOM by replacing discrete controllers.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a RoHS-compliant surface-mount VFBGA package for industrial deployments.

Why Choose LCMXO3LF-6900E-6MG324I?

This MachXO3-family FPGA balances configurable logic capacity, embedded memory and a high I/O count in a compact 324-VFBGA package for industrial applications. Its non-volatile, multi-time programmable architecture and on-chip hardened peripherals make it well suited for designers who need flexible interface handling, board-level control, and in-field update capability within an industrial temperature envelope.

For teams designing system glue logic, interface bridges or embedded control functions, the LCMXO3LF-6900E-6MG324I provides a scalable, reprogrammable platform backed by the MachXO3 family feature set and system-level support described in the product documentation.

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