LCMXO3LF-9400C-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 589 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400C-5BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

The LCMXO3LF-9400C-5BG256I is a MachXO3 family FPGA IC designed for industrial applications requiring flexible on-chip logic, ample I/O, and embedded memory. Its architecture combines approximately 9,400 logic elements (1175 CLBs) with embedded block RAM and a wide set of on-chip system features exposed in the MachXO3 datasheet.

Targeted at system control, interface bridging and I/O-intensive designs, the device offers a high I/O count, non-volatile multi-time programmable configuration, and on-chip peripherals that simplify integration in industrial temperature environments.

Key Features

  • Core Logic  Approximately 9,400 logic elements (1175 CLBs) provide programmable fabric for glue logic, protocol bridging, and control functions.
  • Embedded Memory  Approximately 442,368 bits of embedded memory (~0.44 Mbits) in sysMEM blocks, supporting single/dual-port and FIFO modes for buffering and local storage.
  • I/O and Interfaces  206 general-purpose I/O pins with programmable I/O cells and pre‑engineered source-synchronous I/O capabilities for flexible interface implementation.
  • Configuration and Non‑Volatility  Non-volatile, multi-time programmable configuration with TransFR reconfiguration and on-chip user flash memory (UFM) described in the MachXO3 family datasheet.
  • Clocking and Timing  Flexible on-chip clocking including sysCLOCK Phase Locked Loops (PLLs) and clock distribution network for system timing management.
  • Embedded Hardened IP  Hardened peripherals such as I²C and SPI IP cores, timers/counters, and other system level IP documented in the family datasheet to accelerate common design tasks.
  • On-Chip Utilities  On-chip oscillator, programmable I/O buffers, and support for hot-socketing and boundary-scan testability as outlined in the MachXO3 datasheet.
  • Power and Packaging  Operates from a 2.375 V to 3.465 V supply range, supplied in a 256‑LFBGA (256‑CABGA, 14×14) surface-mount package for compact board-level integration.
  • Industrial Grade  Qualified for an operating temperature range of −40 °C to 100 °C and RoHS compliant for industrial deployments.

Typical Applications

  • Industrial Control  Use the device’s industrial temperature rating, abundant I/O and embedded logic to implement sensor aggregation, motor control interfaces, and machine control glue logic.
  • Interface Bridging  Leverage the hardened I²C/SPI cores and flexible I/O cells to bridge disparate peripheral buses and implement protocol converters.
  • System Glue and Management  Deploy the MachXO3 device as board-level glue: manage reset sequencing, power monitoring, and custom control functions using on-chip timers and UFM.
  • User Interface and Peripheral Control  Implement display drivers, GPIO expansion and human‑machine interface logic making use of plentiful I/O and embedded memory for buffering.

Unique Advantages

  • Highly integrated programmable fabric: Combines ~9,400 logic elements with embedded RAM and hardened IP to reduce external components and simplify BOM.
  • Large I/O capacity: 206 I/Os enable direct connection to many peripherals and sensors without additional multiplexing hardware.
  • Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Flexible clocking and timing: On-chip PLLs and a dedicated clock distribution network support diverse system timing needs described in the MachXO3 family documentation.
  • Compact, surface-mount package: 256‑LFBGA (256‑CABGA, 14×14) packaging allows high-density PCB layouts while maintaining accessibility to many I/Os.
  • Documented family features and IP: The MachXO3 family datasheet details the device’s embedded peripherals and configuration options to accelerate design and verification.

Why Choose LCMXO3LF-9400C-5BG256I?

The LCMXO3LF-9400C-5BG256I positions itself as a versatile industrial-grade FPGA for applications that need a balance of programmable logic, on-chip memory, and high I/O count in a compact surface-mount package. Its MachXO3 family features—including non‑volatile configuration, hardened IP blocks, and flexible clocking—help reduce external components and shorten integration time.

This device is suited for engineers building industrial control systems, interface bridges, and board-level management functions who require a documented, reprogrammable solution that operates across a wide temperature range and supports a broad supply voltage window.

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