LCMXO3LF-6900E-6MG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-VFBGA, CSPBGA |
|---|---|
| Quantity | 221 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CSFBGA (9x9) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-VFBGA, CSPBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3LF-6900E-6MG256I – MachXO3 Field Programmable Gate Array (FPGA), 6,864 logic elements, 245,760-bit RAM, 206 I/Os, 256-VFBGA
The LCMXO3LF-6900E-6MG256I is a MachXO3 family Field Programmable Gate Array (FPGA) in a compact 256-VFBGA (9×9) package. It combines a moderate logic capacity with embedded RAM and a high I/O count for flexible system integration in industrial environments.
This device targets designs that require programmable logic, on-chip memory, and a dense I/O footprint while operating from a low supply voltage and across an industrial temperature range.
Key Features
- Core Logic 6,864 logic elements provide a programmable fabric for implementing state machines, glue logic, and control functions.
- Embedded Memory Approximately 245,760 bits (≈0.246 Mbits) of on-chip RAM for FIFOs, buffers, and small data structures.
- I/O Density 206 programmable I/O pins to support multiple interfaces and external peripherals on a single device.
- Advanced Packaging 256-VFBGA, CSPBGA (supplier device package: 256-CSFBGA 9×9) in a surface-mount form factor for space-constrained PCBs.
- Voltage and Power Narrow core supply range of 1.14 V to 1.26 V to match low-voltage system domains.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Non-volatile, Multi-time Programmable Configuration MachXO3 family features non-volatile configuration memory for multi-time programmability and secure startup behavior.
- Flexible On‑Chip Resources Architecture elements in the MachXO3 family (slices, routing, PLLs, programmable I/O cells, and embedded block RAM) enable configurable clocking, I/O behavior, and memory modes such as single/dual-port and FIFO operation.
- Surface Mount Mounting Designed for standard surface-mount assembly workflows.
- RoHS Compliant Device meets RoHS environmental requirements.
Typical Applications
- Industrial Control and Automation Industrial-rated operation (−40 °C to 100 °C) and flexible logic make it suitable for control functions, signal conditioning, and I/O consolidation in automation equipment.
- I/O-Dense Embedded Systems With 206 I/Os, the device is useful for designs that require many external interfaces, LED/keypad drivers, or peripheral aggregation on a single FPGA.
- Embedded Memory and Buffering Approximately 245,760 bits of on-chip RAM support small FIFOs and buffering for real-time data handling and interface bridging.
- Compact, Space-Constrained Designs The 256-VFBGA (9×9) package and surface-mount mounting suit compact boards where board area and component height are at a premium.
Unique Advantages
- Highly Integrated Logic and I/O: Combines 6,864 logic elements with 206 I/Os to reduce external glue logic and simplify system-level integration.
- On‑Chip Memory for Control and Buffers: Approximately 245,760 bits of embedded RAM enable local data storage for FIFOs, state machines, and small data buffering without external memory.
- Industrial-Grade Operation: Specified operating temperature from −40 °C to 100 °C supports deployment in industrial environments where extended temperature ranges are required.
- Compact, Surface-Mount Package: 256-VFBGA (9×9) CSPBGA package provides a compact footprint for dense board designs.
- Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains and power-optimized designs.
- Non‑volatile, Multi-time Programmable Configuration: Built-in non-volatile configuration enables persistent device behavior and field reprogramming without external configuration memory.
Why Choose LCMXO3LF-6900E-6MG256I?
The LCMXO3LF-6900E-6MG256I positions itself as a compact, industrial-grade FPGA option that balances programmable logic capacity, embedded memory, and a high number of I/Os in a small BGA package. Its MachXO3 family architecture provides flexible on-chip resources—programmable I/O, block RAM modes, and configurable clocking—making it suitable for varied embedded and system integration tasks.
Designers targeting industrial or space-constrained applications will find the device advantageous for reducing bill-of-materials and consolidating control, interface, and buffering functions into a single, non-volatile programmable device backed by the MachXO3 family architecture.
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