LCMXO3LF-6900E-6MG256C

The LCMXO3LF-6900E-6MG256C is a MachXO3 family field programmable gate array in a 256-ball VFBGA (CSPBGA) package designed for surface-mount applications. It integrates 6,864 logic elements, approximately 0.246 Mbits of on-chip RAM, and 206 I/O to address control, glue-logic and I/O-intensive designs requiring non-volatile, reprogrammable logic.

With a low supply voltage range (1.14 V to 1.26 V) and commercial operating range (0 °C to 85 °C), this device targets mainstream embedded systems where compact packaging, I/O density and integrated system features reduce board-level complexity.

Key Features

• Logic Capacity — 6,864 logic elements (cells) to implement glue logic, control functions and moderate-density programmable logic.
• Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 total RAM bits) for buffering, FIFOs and small data structures.
• I/O Density — 206 programmable I/O pins to support multiple peripherals, buses and interface standards.
• Package & Mounting — 256-VFBGA (CSPBGA) surface-mount package (supplier package: 256-CSFBGA 9×9) for compact board integration.
• Power and Temperature — Supply voltage range 1.14 V to 1.26 V and operating temperature 0 °C to 85 °C (commercial grade).
• Non-Volatile, Reprogrammable Architecture — MachXO3 family features such as non-volatile multi-time programmable configuration and TransFR reconfiguration enable persistent FPGA functionality and field updates.
• Clocking and Timing — On-chip clocking primitives including PLLs and flexible clock distribution to support system timing needs (as described in family documentation).
• Embedded System IP — Hardened on-chip IP blocks referenced in the family documentation, including I²C, SPI and timer/counter functions, plus user flash memory (UFM) for system data storage.
• System-level Features — Support for boundary-scan testability (IEEE 1149.1), hot-socketing considerations and standby/power-saving modes noted in the family datasheet.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Interface Bridging and I/O Expansion — Use the 206 I/O and embedded logic to bridge disparate buses or expand peripheral connectivity on compact boards.
• System Glue Logic and Control — Implement control sequencing, state machines and custom control paths using available logic elements and on-chip memory.
• Configuration and Secure Data Storage — Leverage the device’s non-volatile configuration and user flash memory for persistent settings and system configuration storage.
• Embedded Peripherals and Timing — Take advantage of hardened I²C/SPI IP and on-chip PLLs/timers for peripheral interfacing and precise clock management.

Unique Advantages

• Compact, high-density packaging: 256-ball VFBGA (CSPBGA) provides a small footprint with high I/O count for space-constrained designs.
• Integrated, non-volatile configuration: Multi-time programmable non-volatile configuration reduces the need for external configuration memory and simplifies system start-up.
• Balanced logic and memory resources: 6,864 logic elements paired with ~0.246 Mbits of embedded RAM supports moderate-complexity functions without large external SRAM.
• System-level IP and features: Hardened I/O-related IP, UFM and boundary-scan support lower development time and simplify common embedded functions.
• Designed for commercial embedded systems: Commercial grade temperature range and RoHS compliance suit mainstream consumer and industrial electronics (non-automotive) applications.

Why Choose LCMXO3LF-6900E-6MG256C?

This MachXO3 device balances I/O density, reprogrammable logic and on-chip memory in a compact 256-VFBGA package for designers needing persistent, flexible logic in commercial embedded products. Its combination of non-volatile configuration, embedded IP blocks and system-level features reduces board-level BOM and accelerates development of control, interface and glue-logic functions.

Choose LCMXO3LF-6900E-6MG256C when you require a surface-mount, commercially graded FPGA with substantial I/O, integrated memory and reprogrammable non-volatile configuration for scalable, maintainable embedded designs.

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