LCMXO3LF-6900E-5MG256C

IC FPGA 206 I/O 256CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-VFBGA, CSPBGA

Quantity 1,054 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (9x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-VFBGA, CSPBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3LF-6900E-5MG256C – MachXO3 FPGA, 6,864 Logic Elements, 245,760-bit RAM, 206 I/O, 256‑VFBGA

The LCMXO3LF-6900E-5MG256C is a MachXO3 family field-programmable gate array optimized for board-level control, glue logic and I/O-rich embedded tasks. It combines a mid-range programmable fabric with on-chip memory and flexible I/O in a compact 256‑VFBGA surface-mount package.

Designed for commercial-grade applications, this device delivers 6,864 logic elements, 245,760 bits of embedded RAM, and up to 206 I/O pins while supporting non-volatile, multi-time programmable configuration features described in the MachXO3 family datasheet.

Key Features

  • Logic Capacity — 6,864 logic elements and 858 LABs, providing a mid-range programmable fabric for control, glue logic and interface tasks.
  • Embedded Memory — 245,760 bits of on-chip RAM (approximately 0.246 Mbits) for buffering, small FIFOs or local data storage.
  • I/O Resources — Up to 206 I/O pins for broad connectivity and signal interfacing on board-level designs.
  • Package & Mounting — 256‑VFBGA / CSPBGA family packaging (256‑CSFBGA, 9×9), surface-mount mounting type for compact board integration.
  • Low‑Voltage Core — Core supply range of 1.14 V to 1.26 V to match low-voltage system power rails.
  • Commercial Operating Range — Rated for 0 °C to 85 °C operation to suit standard commercial environments.
  • Non‑volatile, Multi‑time Programmable Architecture — MachXO3 family features include non-volatile configuration and multi-time programmability (family-level feature documented in the datasheet).
  • Built‑in System Functions (Family‑Level) — MachXO3 family datasheet documents embedded hardened IP such as I²C and SPI cores, timers/counters, on‑chip oscillator, PLLs and user flash memory (UFM) for common system tasks.
  • Compliance — RoHS‑compliant device suitable for standard commercial procurement.

Typical Applications

  • Board‑level Control & Glue Logic — Use the device’s 6,864 logic elements and 206 I/Os to implement control sequencers, protocol adapters and glue logic between system components.
  • I/O Expansion and Interface Bridging — The extensive I/O count supports signal translation and interface consolidation on dense PCBs.
  • Embedded Memory Functions — On‑chip RAM (245,760 bits) enables small buffering, FIFOs and local data storage for timing and data-path tasks.

Unique Advantages

  • Integrated mid‑range programmable fabric — 6,864 logic elements provide the capacity to implement complex glue logic and control functions without requiring additional discrete logic ICs.
  • High I/O density — 206 I/O pins reduce the need for external expanders and simplify board routing for I/O‑heavy designs.
  • Compact package — 256‑VFBGA / 256‑CSFBGA (9×9) packaging offers a small footprint for space-constrained applications while retaining high pin count.
  • Non‑volatile configuration (family feature) — Multi-time programmable configuration eliminates the need for an external configuration ROM in many designs, simplifying BOM and startup logic.
  • Family-level embedded IP and system functions — Hardened I²C/SPI cores, PLLs, oscillator and UFM availability (as documented for the MachXO3 family) speed development of common control and interface functions.
  • Commercial-grade operating range — Rated 0 °C to 85 °C to match general-purpose embedded and consumer applications.

Why Choose LCMXO3LF-6900E-5MG256C?

This MachXO3 device balances logic capacity, embedded memory and high I/O count in a compact 256‑VFBGA surface-mount package, offering a practical solution for designers who need a programmable, non-volatile FPGA fabric for board-level control, interface consolidation and small data buffering. The device’s low-voltage core range and documented MachXO3 family features such as on‑chip oscillator, PLLs and hardened IP functions provide a streamlined platform for rapid development and reduced BOM.

Ideal for engineering teams seeking a commercially graded, RoHS‑compliant FPGA with mid-range resources, the LCMXO3LF-6900E-5MG256C delivers integration and flexibility that scale with typical embedded system requirements while relying on the MachXO3 family ecosystem and documentation for design support.

Request a quote or submit an inquiry to source the LCMXO3LF-6900E-5MG256C for your next design project.

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