LCMXO3LF-6900C-6BG324I

The LCMXO3LF-6900C-6BG324I is a MachXO3 family FPGA IC designed for industrial embedded applications. It combines 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and up to 279 general-purpose I/O to support complex control, interfacing and glue-logic tasks.

Built for robust system-level integration, this device includes MachXO3 family capabilities such as non-volatile, multi-time programmable configuration, flexible on-chip clocking and embedded hardened IP, while operating over an industrial temperature range and a wide supply range.

Key Features

• Logic Capacity — 6,864 logic elements to implement medium-density FPGA designs and system glue logic.
• Embedded Memory — 245,760 bits of on-chip RAM (approximately 0.246 Mbits) for data buffering, FIFOs and small memory blocks.
• I/O Density — Up to 279 I/O pins for broad connectivity and interface consolidation in a single device.
• Non-volatile, Multi-time Programmable Configuration — MachXO3 family non-volatile configuration and TransFR reconfiguration options for flexible system updates and in-field reprogramming.
• Flexible On-chip Clocking — Family-level support for PLLs and clock distribution to manage multiple clock domains (as described in the MachXO3 family data).
• Embedded Hardened IP — MachXO3 family includes hardened IP blocks such as I²C, SPI and timer/counter functions to simplify common peripheral control and protocol handling.
• Programmable I/O and I/O Standards — High-performance, flexible I/O buffer architecture and programmable I/O cells (as described in the MachXO3 family) to support a range of interfacing needs.
• Package and Mounting — 324-LFBGA (324-CABGA, 15 × 15 mm) surface-mount package for compact board-level integration.
• Power and Temperature — Wide supply range of 2.375 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C for harsh environments.
• Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control — Industrial-grade temperature range (−40 °C to 100 °C) and flexible I/O make the device suitable for factory automation and control systems requiring reliable operation in demanding environments.
• Protocol Bridging and Interface Consolidation — Large I/O count (279) combined with hardened I²C and SPI IP supports protocol translation, sensor aggregation and board-level interface consolidation.
• Embedded System Glue Logic — 6,864 logic elements and embedded RAM enable implementation of glue logic, state machines and small-data buffering between subsystems.

Unique Advantages

• Integrated Non-volatile Configuration: Multi-time programmable non-volatile configuration simplifies system provisioning and field updates without external configuration memory.
• High I/O Density: 279 I/Os reduce the need for external multiplexers or additional devices when consolidating interfaces on a single FPGA.
• Industrial-Grade Operation: Specified for −40 °C to 100 °C and a broad supply window (2.375 V–3.465 V), enabling deployment in temperature- and voltage-variable environments.
• Compact, High-pin Package: 324-LFBGA (15 × 15 mm) package delivers substantial logic and I/O in a compact footprint for space-constrained designs.
• Embedded Peripheral IP: Built-in I²C, SPI and timer/counter blocks reduce external component count and accelerate time-to-market for common control interfaces.
• RoHS-compliant Supply Chain: Environmentally compliant manufacturing status supports regulatory and OEM procurement requirements.

Why Choose LCMXO3LF-6900C-6BG324I?

The LCMXO3LF-6900C-6BG324I positions MachXO3 family capabilities—non-volatile programming, flexible clocking and hardened peripheral IP—into a compact, industrial-grade package. Its combination of 6,864 logic elements, substantial I/O capacity and embedded RAM provides a balanced platform for embedded system designers who need reliable interface consolidation and field-updatable logic in industrial environments.

This device is appropriate for engineers building robust, scalable designs that benefit from on-chip peripherals and non-volatile configuration, while keeping board area and external component count low.

Request a quote or submit an inquiry to receive pricing and availability details for the LCMXO3LF-6900C-6BG324I.