LCMXO3LF-6900E-5MG256I

The LCMXO3LF-6900E-5MG256I is a MachXO3 family FPGA IC that combines a mid-density programmable fabric with embedded memory and flexible I/O in a compact 256-VFBGA (256-CSFBGA 9×9) package. The device provides 6,864 logic elements and 245,760 bits of on-chip RAM, making it suitable for control, glue-logic and I/O-centric functions in industrial systems.

Designed for surface-mount assembly and rated for industrial operation, the device supports a 1.14 V to 1.26 V core supply and an operating temperature range of -40 °C to 100 °C. The MachXO3 family architecture includes on-chip clocking, programmable I/O structures and embedded hardened IP functions to streamline system integration and configuration.

Key Features

• Core / Logic  Approximately 6,864 logic elements provide the programmable fabric for glue logic, control state machines and custom acceleration.
• Embedded Memory  Approximately 0.246 Mbits of embedded memory (245,760 bits) implemented as sysMEM block RAM for FIFOs, buffers and small data tables.
• I/O Capacity & Flexibility  206 programmable I/O pins in the device package support a range of interface uses and external signal requirements.
• Non-volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities for in-system updates and secure boot strategies.
• Embedded Hardened IP  The family includes embedded hardened IP functions such as I²C and SPI cores, timers/counters and user flash memory (UFM) referenced in the MachXO3 datasheet.
• Clocking & Timing  On-chip oscillators and sysCLOCK PLLs are part of the architecture to support flexible clock distribution and source-synchronous I/O use cases.
• Package & Mounting  256-VFBGA (256-CSFBGA, 9×9) surface-mount package provides a compact footprint for board-level integration.
• Power & Environmental  Core voltage range: 1.14 V to 1.26 V. Industrial operating temperature: -40 °C to 100 °C. RoHS compliant.

Typical Applications

• Industrial Control  Local I/O aggregation, protocol bridging and control logic where the industrial temperature range and robust I/O count are required.
• Interface & Glue Logic  Board-level interface translation, bus bridging and peripheral aggregation using the available logic elements and embedded memory.
• Configuration & System Management  Non-volatile, multi-time programmable configuration and UFM support device-level boot, configuration storage and in-field updates.
• Embedded Peripheral Offload  Offload timers, SPI/I²C endpoints and simple state machines to free the host MCU using the hardened IP and programmable fabric.

Unique Advantages

• Mid-density, practical logic size:  6,864 logic elements offer a balance between capability and board-level cost for control and glue-logic tasks.
• On-chip RAM for buffering:  Approximately 0.246 Mbits of embedded memory enables FIFOs and data buffering without external memory.
• High I/O count:  206 I/O pins simplify system routing for multi-peripheral and multi-sensor designs.
• Non-volatile, field-updatable configuration:  Multi-time programmable configuration and TransFR reconfiguration support in-field updates and flexible provisioning.
• Industrial operating range:  Rated from -40 °C to 100 °C for deployment in industrial environments.
• Compact BGA package:  256-VFBGA (256-CSFBGA 9×9) provides a small footprint for space-constrained PCBs.

Why Choose LCMXO3LF-6900E-5MG256I?

The LCMXO3LF-6900E-5MG256I positions itself as a compact, industrial-grade MachXO3 FPGA option for designers needing a practical balance of logic, memory and high I/O density. Its non-volatile configuration, embedded hardened IP and on-chip clocking features reduce external components and simplify board-level system design.

This part is suited to engineers designing industrial control nodes, interface bridges, configuration managers and peripheral offload modules who require a surface-mount BGA package, mid-range logic capacity and a dependable operating temperature window. The device’s combination of programmable fabric, on-chip RAM and configuration flexibility supports scalable designs and in-field updates.

Request a quote or submit a purchase inquiry for LCMXO3LF-6900E-5MG256I to evaluate how this MachXO3 device can fit into your next design.