LCMXO3LF-6900C-6BG400I

The LCMXO3LF-6900C-6BG400I is a MachXO3 family FPGA offering non-volatile, multi-time programmable logic in a 400-ball LFBGA package. It combines a compact logic fabric with embedded memory, high I/O density and flexible on-chip system functions for industrial applications.

Designed for industrial environments, this device provides reprogrammable system logic with an extended operating range and a broad supply window, enabling use in embedded control, I/O consolidation and system management roles.

Key Features

• Logic Capacity  Approximately 6,864 logic elements providing the equivalent of medium-density programmable logic for control, glue logic and interface tasks.
• Embedded Memory  Approximately 0.246 Mbits of embedded block RAM (245,760 bits) for data buffering, state storage and small on-chip data structures.
• I/O Density  Up to 335 user I/O pins to support extensive peripheral and bus connectivity in a single device.
• Non‑volatile, Multi-time Programmable  MachXO3 family architecture supports non-volatile configuration and multiple reprogram cycles for field updates and iterative development.
• Flexible Clocking  On-chip clock resources including PLLs and an internal oscillator enable flexible on-chip clock generation and distribution.
• Hardened System IP  Embedded hardened IP functions documented for the family include I²C and SPI cores and timer/counter blocks to simplify peripheral interfacing and system tasks.
• Configuration & Management  Features such as User Flash Memory (UFM), TransFR reconfiguration and IEEE 1149.1-compatible boundary-scan testability support in-system configuration and test flows.
• Power and Reliability Options  Standby and power-saving options plus hot-socketing considerations are included in the family data for system-level power management and serviceability.
• Package & Mounting  400-LFBGA (supplier package 400-CABGA 17×17) surface-mount package for compact board-level integration.
• Electrical & Environmental  Supply range: 2.375 V to 3.465 V; industrial operating temperature range: −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial Control Systems  Non-volatile reprogrammable logic and an industrial temperature range make the device suitable for embedded controllers and automation equipment.
• I/O-Intensive Subsystems  High I/O count enables consolidation of multiple peripheral interfaces and bus buffering within a single FPGA footprint.
• System Configuration & Management  On-chip UFM, TransFR reconfiguration and boundary-scan support the device’s use in configuration management, system monitoring and in-field updates.
• Peripheral Bridging and Interface Logic  Embedded hardened I²C/SPI IP and timers ease implementation of protocol bridging, sensor interfaces and peripheral control functions.

Unique Advantages

• High I/O Integration: With up to 335 I/Os, the device reduces the need for external GPIO expanders and simplifies board routing.
• On-board Memory Resources: Approximately 0.246 Mbits of embedded RAM supports local buffering and small data structures without external memory.
• Industrial-Ready Thermal Range: Rated for −40 °C to 100 °C, suitable for industrial environments requiring extended temperature operation.
• Flexible Power and Supply Compatibility: Wide supply range (2.375 V–3.465 V) supports varied system power architectures and eases integration.
• Built-in System Functions: Hardened I²C/SPI cores, timers and UFM reduce software overhead and external component count for common system tasks.
• Compact, Serviceable Packaging: 400-ball LFBGA surface-mount package delivers a compact footprint while supporting industry-standard board assembly.

Why Choose LCMXO3LF-6900C-6BG400I?

The LCMXO3LF-6900C-6BG400I delivers a balanced combination of reprogrammable non-volatile logic, meaningful embedded memory, and a high I/O count in a compact 400-LFBGA package. Its industrial operating range and flexible supply window make it appropriate for embedded systems and industrial designs that require reliable on-board logic, interface consolidation and in-field configurability.

Targeted at engineers building control, I/O expansion and system-management functions, this MachXO3 family device offers on-chip system IP and configuration features that simplify BOM and board-level integration while supporting iterative development and in‑field updates.

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