LCMXO3LF-6900C-6BG324C

The LCMXO3LF-6900C-6BG324C is a MachXO3 family FPGA offering a balance of logic capacity, embedded memory, and high I/O density in a compact 324-LFBGA package. Built for commercial-grade embedded designs, it combines reconfigurable logic with on-chip memory and system-level features to support interface bridging, control logic, and glue‑logic functions.

This device provides 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and 279 general-purpose I/Os, with a supply voltage range of 2.375 V to 3.465 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  6,864 logic elements providing reconfigurable fabric capacity for control, glue logic, and interface functions.
• Embedded Memory  Total on-chip RAM of 245,760 bits (approximately 0.246 Mbits) for local buffering, FIFOs, and small data stores.
• High I/O Density  279 I/O pins suitable for multi‑interface designs and dense connectivity in a single device.
• Configuration and Non-volatile Storage  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• Hardened System IP  Embedded hardened IP blocks such as I2C and SPI cores, timer/counter, and user flash memory (UFM) to simplify common system functions.
• Clocking and Timing  On-chip clocking resources including PLLs and on‑chip oscillator options for flexible clock distribution and synthesis.
• Power and Operating Range  Supply voltage range of 2.375 V to 3.465 V, commercial operating temperature from 0 °C to 85 °C, and standby/power‑saving modes documented in the family datasheet.
• Package and Mounting  324-LFBGA (supplier device package: 324-CABGA, 15×15 mm) in a surface-mount form factor for compact board implementation.
• Design-for-Test and Reliability  IEEE 1149.1-compliant boundary-scan testability and device configuration/testing features described in the MachXO3 family datasheet.
• Regulatory  RoHS-compliant.

Typical Applications

• Interface Bridging and Gluing  Use the high I/O count and embedded hardened I2C/SPI IP to connect disparate peripherals and implement protocol translation or bus bridging.
• Control and Sequencing  Implement control state machines and timing logic leveraging the device’s logic elements, on‑chip clocks/PLLs, and timers.
• Local Data Buffering  Employ the approximately 0.246 Mbits of embedded RAM for small FIFOs, buffering, and packet staging in embedded subsystems.
• System Integration  Consolidate glue logic, GPIO expansion, and peripheral interfaces within a single surface-mount 324-LFBGA package to reduce BOM and board area.

Unique Advantages

• High I/O and Logic in a Compact Package: 279 I/Os and 6,864 logic elements in a 324-LFBGA (15×15 mm) form factor enable dense integration without large packages.
• Non-volatile, Reprogrammable Configuration: Multi-time programmable, non-volatile configuration lets you field-update logic and iterate designs without external configuration memory.
• Embedded Hardened IP Reduces Design Time: Integrated I2C, SPI and timer/counter IP offload common functions from fabric and simplify firmware and HDL development.
• Flexible Clocking and Power Options: On-chip PLLs, oscillator, and standby/power-saving options support varied timing architectures and low-power modes documented for the family.
• Commercial Grade for Standard Embedded Products: Rated for 0 °C to 85 °C and RoHS-compliant, making it suitable for mainstream electronics and consumer systems.
• Design and Test Support: Boundary-scan (IEEE 1149.1) and documented configuration/testing features help streamline board bring-up and manufacturing test.

Why Choose LCMXO3LF-6900C-6BG324C?

The LCMXO3LF-6900C-6BG324C positions itself as a practical, commercially graded FPGA for embedded designs that require moderate logic capacity, substantial I/O, and on-chip memory within a compact surface-mount package. Its combination of 6,864 logic elements, approximately 0.246 Mbits of RAM, and 279 I/Os supports a wide range of system‑level functions while keeping board area and component count low.

Engineers designing control logic, interface bridges, and integrated peripheral hubs will find the MachXO3 family features—non-volatile reconfiguration, hardened I/O IP, on-chip clocking, and boundary-scan testability—beneficial for iterative development and production test. The device’s supply voltage and operating temperature specs align with common commercial embedded platforms, and RoHS compliance supports environmental regulations.

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