LCMXO3LF-6900C-5BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 245760 6864 400-LFBGA |
|---|---|
| Quantity | 62 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3LF-6900C-5BG400C – MachXO3 Field Programmable Gate Array (FPGA), 335 I/Os, 6864 logic elements, 400‑LFBGA
The LCMXO3LF-6900C-5BG400C is a MachXO3 family FPGA IC from Lattice Semiconductor Corporation. It combines a non‑volatile, multi‑time programmable architecture with flexible on‑chip clocking and I/O capabilities to support a wide range of embedded logic tasks.
Key on‑chip resources include 6,864 logic elements and approximately 0.246 Mbits of embedded memory, plus 335 user I/Os. The device is supplied in a compact 400‑LFBGA (17×17) surface‑mount package and is specified for commercial temperature operation.
Key Features
- Logic Capacity 6,864 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 0.246 Mbits of on‑chip RAM (245,760 bits) suitable for small buffers, FIFOs and state storage.
- I/O Resources 335 user I/Os with pre‑engineered source‑synchronous I/O and flexible, high‑performance I/O buffers documented in the MachXO3 family data.
- Flexible Clocking On‑chip clocking features including sysCLOCK phase‑locked loops (PLLs) for flexible clock generation and distribution.
- Non‑volatile Configuration Multi‑time programmable non‑volatile configuration to retain designs without external configuration memory.
- Embedded Hardened IP Family documentation lists embedded hardened functions such as I²C and SPI cores, timers/counters, and user flash memory (UFM).
- Configuration and Reconfiguration Supports TransFR reconfiguration and system level features described in the MachXO3 family datasheet.
- Power and Supply Operates from a supply range of 2.375 V to 3.465 V, with standby and power‑saving modes referenced in family documentation.
- Package and Mounting Surface‑mount 400‑LFBGA package (400‑CABGA, 17×17) for compact board implementations.
- Temperature and Compliance Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
Unique Advantages
- High I/O density: 335 I/Os enable consolidation of multiple interfaces and simplify board routing for complex peripheral sets.
- Balanced logic and memory: 6,864 logic elements paired with ~0.246 Mbits of embedded RAM accommodate moderate logic fabrics with on‑chip storage.
- Non‑volatile, reprogrammable configuration: Multi‑time programmability and TransFR reconfiguration allow in‑field updates without external configuration flash.
- Integrated system IP: Hardened I²C, SPI and timer/counter functions reduce RTL development and help lower BOM by providing common peripherals on‑chip.
- Flexible clocking and I/O: On‑chip PLLs and pre‑engineered source‑synchronous I/O options simplify timing closure for synchronous interfaces.
- Compact packaging: 400‑LFBGA (17×17) surface‑mount package delivers a small footprint for space‑constrained designs.
Why Choose LCMXO3LF-6900C-5BG400C?
The LCMXO3LF-6900C-5BG400C positions itself as a versatile, commercially graded FPGA option within the MachXO3 family, offering a balance of logic capacity, embedded memory and high I/O count in a compact 400‑LFBGA package. Its non‑volatile, multi‑time programmable configuration and integrated hardened IP elements help streamline development and reduce external component requirements.
This device is suitable for designs that require moderate logic density, extensive I/O, and flexible on‑chip resources, while operating within a commercial temperature range. Its documented family features—on‑chip clocking, sysMEM, source‑synchronous I/O and configuration options—support scalable prototyping and deployment where these capabilities are required.
If you would like pricing, availability, or to request a quote for the LCMXO3LF-6900C-5BG400C, please submit a quote request or contact sales for more information.