LCMXO3LF-6900C-5BG400C

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 245760 6864 400-LFBGA

Quantity 62 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3LF-6900C-5BG400C – MachXO3 Field Programmable Gate Array (FPGA), 335 I/Os, 6864 logic elements, 400‑LFBGA

The LCMXO3LF-6900C-5BG400C is a MachXO3 family FPGA IC from Lattice Semiconductor Corporation. It combines a non‑volatile, multi‑time programmable architecture with flexible on‑chip clocking and I/O capabilities to support a wide range of embedded logic tasks.

Key on‑chip resources include 6,864 logic elements and approximately 0.246 Mbits of embedded memory, plus 335 user I/Os. The device is supplied in a compact 400‑LFBGA (17×17) surface‑mount package and is specified for commercial temperature operation.

Key Features

  • Logic Capacity  6,864 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Approximately 0.246 Mbits of on‑chip RAM (245,760 bits) suitable for small buffers, FIFOs and state storage.
  • I/O Resources  335 user I/Os with pre‑engineered source‑synchronous I/O and flexible, high‑performance I/O buffers documented in the MachXO3 family data.
  • Flexible Clocking  On‑chip clocking features including sysCLOCK phase‑locked loops (PLLs) for flexible clock generation and distribution.
  • Non‑volatile Configuration  Multi‑time programmable non‑volatile configuration to retain designs without external configuration memory.
  • Embedded Hardened IP  Family documentation lists embedded hardened functions such as I²C and SPI cores, timers/counters, and user flash memory (UFM).
  • Configuration and Reconfiguration  Supports TransFR reconfiguration and system level features described in the MachXO3 family datasheet.
  • Power and Supply  Operates from a supply range of 2.375 V to 3.465 V, with standby and power‑saving modes referenced in family documentation.
  • Package and Mounting  Surface‑mount 400‑LFBGA package (400‑CABGA, 17×17) for compact board implementations.
  • Temperature and Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Unique Advantages

  • High I/O density: 335 I/Os enable consolidation of multiple interfaces and simplify board routing for complex peripheral sets.
  • Balanced logic and memory: 6,864 logic elements paired with ~0.246 Mbits of embedded RAM accommodate moderate logic fabrics with on‑chip storage.
  • Non‑volatile, reprogrammable configuration: Multi‑time programmability and TransFR reconfiguration allow in‑field updates without external configuration flash.
  • Integrated system IP: Hardened I²C, SPI and timer/counter functions reduce RTL development and help lower BOM by providing common peripherals on‑chip.
  • Flexible clocking and I/O: On‑chip PLLs and pre‑engineered source‑synchronous I/O options simplify timing closure for synchronous interfaces.
  • Compact packaging: 400‑LFBGA (17×17) surface‑mount package delivers a small footprint for space‑constrained designs.

Why Choose LCMXO3LF-6900C-5BG400C?

The LCMXO3LF-6900C-5BG400C positions itself as a versatile, commercially graded FPGA option within the MachXO3 family, offering a balance of logic capacity, embedded memory and high I/O count in a compact 400‑LFBGA package. Its non‑volatile, multi‑time programmable configuration and integrated hardened IP elements help streamline development and reduce external component requirements.

This device is suitable for designs that require moderate logic density, extensive I/O, and flexible on‑chip resources, while operating within a commercial temperature range. Its documented family features—on‑chip clocking, sysMEM, source‑synchronous I/O and configuration options—support scalable prototyping and deployment where these capabilities are required.

If you would like pricing, availability, or to request a quote for the LCMXO3LF-6900C-5BG400C, please submit a quote request or contact sales for more information.

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