LCMXO3LF-6900C-5BG256C

The LCMXO3LF-6900C-5BG256C is a MachXO3 family FPGA IC from Lattice Semiconductor Corporation. It provides a non-volatile, multi-time programmable FPGA architecture with flexible on-chip clocking, hardened peripheral IP, and advanced I/O options suitable for a wide range of embedded control and interface designs.

This device integrates 6,864 logic elements, 206 I/Os, and approximately 0.246 Mbits of embedded memory in a 256-LFBGA package, delivering a compact, surface-mount solution for commercial-grade applications operating from 0 °C to 85 °C with RoHS compliance.

Key Features

• Logic Capacity  6,864 logic elements (cells) to implement glue logic, state machines, and custom logic functions.
• Embedded Memory  Approximately 0.246 Mbits of on-chip RAM (245,760 total RAM bits) for FIFOs, buffers, and small data structures.
• I/O Density  206 general-purpose I/Os supporting flexible interfacing and I/O-intensive designs.
• Non-volatile, Multi-time Programmable  MachXO3 family architecture supports non-volatile, reprogrammable configuration and TransFR reconfiguration capability (series feature).
• Hardened IP and System Functions  Includes hardened IP building blocks referenced in the MachXO3 family data (I2C, SPI, timer/counter, user flash memory) to accelerate common embedded functions.
• Flexible On-Chip Clocking  On-chip PLLs and flexible clock distribution (series-level feature) to support a range of timing architectures.
• Power and Supply Range  Operates from 2.375 V to 3.465 V, accommodating common embedded power rails.
• Package & Mounting  256-LFBGA (supplier device package: 256-CABGA, 14×14) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C for commercial-grade system deployments.
• Standards & Compliance  RoHS compliant.

Typical Applications

• Interface Bridging  Leverage 206 I/Os and hardened serial IP blocks to implement protocol bridging and peripheral interfacing between subsystems.
• Control and Glue Logic  Use the device’s 6,864 logic elements and embedded RAM for board-level control, multiplexing, and state-machine functions.
• Embedded Peripherals  Hardened I2C/SPI and timer/counter functions simplify integration of sensors, memory, and other peripherals in compact designs.
• Clocking and Timing  On-chip PLLs and flexible clock distribution support custom timing domains and source-synchronous I/O implementations referenced in the MachXO3 family.

Unique Advantages

• Compact, High‑I/O Package: The 256-LFBGA package delivers 206 I/Os in a small surface-mount footprint to minimize PCB area while maintaining connectivity.
• Non-volatile Reconfiguration: Multi-time programmable, non-volatile configuration reduces external flash dependency for many system designs.
• Integrated Peripheral IP: Hardened I2C, SPI, and timer/counter functions reduce development time and BOM by providing ready-made peripheral interfaces.
• Flexible Power Support: Broad supply range (2.375 V–3.465 V) allows compatibility with common embedded power rails and simplifies power sequencing.
• Commercial Temperature Support: Rated 0 °C–85 °C for standard commercial applications where that operating range is required.
• Standards-friendly and RoHS Compliant: RoHS compliance supports regulatory requirements for lead-free manufacturing.

Why Choose LCMXO3LF-6900C-5BG256C?

The LCMXO3LF-6900C-5BG256C positions itself as a compact, reprogrammable platform within the MachXO3 family that balances logic density, on-chip memory, and high I/O count in a 256-LFBGA surface-mount package. Its non-volatile, multi-time programmable architecture and hardened peripheral IP make it suitable for designers seeking reduced external component count and faster time-to-functionality for commercial embedded systems.

This device is well suited to engineers and procurement teams implementing control, interface, and timing-focused designs who need a reliable, RoHS-compliant FPGA with flexible supply and a commercial temperature range. The MachXO3 family data sheet provides additional architecture and feature details applicable to this part.

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