LCMXO3LF-640E-6MG121C

The LCMXO3LF-640E-6MG121C is a MachXO3 family FPGA from Lattice Semiconductor designed for compact, configurable logic tasks. It delivers 640 logic elements, on-chip memory, and flexible I/O in a 121-ball VFBGA (CSPBGA) package, targeting commercial-grade embedded designs that require non-volatile configurability and a small-footprint programmable fabric.

This device is optimized for applications that need glue logic, interface bridging, or modest embedded processing in a surface-mount 6×6 mm package while operating within a 1.14 V to 1.26 V supply range and a commercial temperature window of 0 °C to 85 °C.

Key Features

• Core Logic 640 logic elements provide programmable fabric for control, glue logic, and small- to medium-scale state machines and datapaths.
• Embedded Memory Approximately 64 Kbits of on-chip RAM (65,536 total bits) to support FIFOs, small buffers, and local data storage.
• I/O and Packaging 100 user I/Os in a compact 121‑VFBGA (CSPBGA) 121‑CSFBGA (6×6) surface-mount package for space-constrained PCB designs.
• Power and Temperature Operates from a 1.14 V to 1.26 V supply and is specified for commercial operation from 0 °C to 85 °C.
• Non-volatile, Multi-time Programmable Configuration MachXO3 family features include non-volatile, multi-time programmable configuration enabling field reprogramming without external flash.
• Flexible On‑chip Clocking and PLLs The family includes flexible clocking resources and sysCLOCK PLLs for clock generation and distribution (as documented in the MachXO3 family datasheet).
• Embedded Hardened IP The MachXO3 family documentation lists hardened peripheral IP such as I2C and SPI cores, and timer/counter functions for common interface and timing needs.
• Configuration, Test and System Features Features documented for the family include IEEE 1149.1-compliant boundary-scan testability, on-chip oscillator, TraceID, user flash memory (UFM), and standby/power-saving modes.
• Compliance RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic Use the 100 I/Os and flexible I/O buffering to implement protocol translation, bus bridging, or board-level glue logic in compact systems.
• Embedded Control and State Machines 640 logic elements combined with on-chip RAM enable small controllers, sequencers, and peripheral managers without external programmable logic.
• Peripheral and Sensor Interfacing Hardened SPI/I2C cores and programmable I/O cells (described in the MachXO3 family datasheet) make the device suitable for connecting sensors and external peripherals.
• Space-Constrained Consumer Designs The 121-ball CSPBGA 6×6 mm surface-mount package lets designers integrate programmable logic into tightly packaged commercial products.

Unique Advantages

• Compact, Surface-Mount Package: 121-VFBGA (121‑CSFBGA, 6×6) package offers programmable logic in a small PCB footprint for space-limited applications.
• Non-volatile Programmability: Multi-time programmable, non-volatile configuration eliminates the need for external configuration flash for many use cases.
• Balanced I/O and Logic Capacity: 100 I/Os paired with 640 logic elements and embedded RAM provides a balanced resource set for interface-centric and control-oriented designs.
• On-board Peripheral IP: Documented MachXO3 family hardened IP (I2C, SPI, timers) reduces implementation effort for common interface functions.
• Defined Commercial Operating Range: Specified supply and temperature range (1.14–1.26 V, 0 °C to 85 °C) supports standard commercial deployments.
• RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing processes.

Why Choose LCMXO3LF-640E-6MG121C?

LCMXO3LF-640E-6MG121C brings MachXO3 family features into a compact, commercial-grade FPGA package suitable for designers who need reliable, non-volatile programmable logic with a strong set of I/O and embedded peripherals. Its 640 logic elements, approximately 64 Kbits of on-chip RAM, and 100 I/Os make it well-suited for glue logic, interface bridging, and embedded control tasks where board space and simplified BOM are priorities.

As part of the MachXO3 family from Lattice Semiconductor, this device offers documented on-chip clocking, hardened peripheral IP, and system-level features such as boundary-scan testability and user flash memory, providing a practical platform for quick integration and field reconfiguration in commercial electronic products.

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