LCMXO3LF-6900E-6MG324C

The LCMXO3LF-6900E-6MG324C is a MachXO3 family FPGA IC offering a flexible, non-volatile programmable fabric for system-level control and interface tasks. Built with on-chip embedded memory and extensive I/O, this device targets boards and modules that require adaptable logic, multi-time programmability, and compact advanced packaging.

Key architectural elements include a programmable logic array with 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and 281 user I/O pins. The device is provided in a 324‑VFBGA package for high-density surface-mount applications and operates from a 1.14 V to 1.26 V core supply at commercial temperatures (0 °C to 85 °C).

Key Features

• Core Logic 6,864 logic elements for programmable combinational and sequential logic integration, enabling glue logic, control and custom logic functions on a single device.
• Embedded Memory Approximately 0.246 Mbits of on-chip RAM suitable for small FIFOs, buffers, and state storage.
• I/O Density & Flexibility 281 user I/O pins support complex board-level interfacing and peripheral control. The device includes flexible I/O buffering and pre‑engineered source-synchronous I/O capabilities as described in the MachXO3 family documentation.
• Configuration & Non-Volatility Non-volatile, multi-time programmable architecture and TransFR reconfiguration features provide in-system programmability and field update capability as defined for the MachXO3 family.
• Clocking & System Timing Flexible on-chip clocking features, including PLLs and distributed clock networks, support a variety of timing architectures referenced in the MachXO3 family documentation.
• Embedded IP & System Support MachXO3 family devices include hardened IP blocks (for example, I²C, SPI, timers/counters) and user flash memory (UFM) to simplify common system functions and configuration storage.
• Package & Mounting 324‑VFBGA (supplier device package 324‑CSFBGA, 10×10) in a surface-mount form factor for compact, high-density board layouts.
• Power & Temperature Core supply range 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• Board-level glue logic — Integrate control, protocol conversion and timing logic to replace multiple discrete components using the device’s programmable fabric and abundant I/O.
• Peripheral and interface control — Implement flexible I/O adapters and peripheral management leveraging 281 user I/Os and the MachXO3 family’s I/O buffering capabilities.
• Field-updatable system functions — Use non-volatile, multi-time programmable configuration and TransFR reconfiguration to deploy in-field updates and feature changes without hardware swaps.
• On-board control and timing — Combine embedded RAM, PLLs and hardened timers/counters to implement local buffering, clock conditioning, and system control tasks.

Unique Advantages

• Compact, high-density package: 324‑VFBGA (10×10) provides a space-efficient option for designs requiring many I/Os and programmable logic in a small footprint.
• Non-volatile, reprogrammable logic: Multi-time programmability and TransFR support enable safe in-system updates and flexible maintenance workflows.
• Significant I/O capability: 281 user I/Os allow consolidation of multiple interface functions into a single device, reducing board complexity.
• Embedded memory for local buffering: Approximately 0.246 Mbits of on-chip RAM supports FIFOs, small data stores and state machines without external memory.
• System-level IP and support: Hardened IP blocks, UFM and boundary-scan/test features described in the MachXO3 family documentation simplify common system functions and testability.
• Commercial-grade operating range: Designed for commercial applications with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Why Choose LCMXO3LF-6900E-6MG324C?

LCMXO3LF-6900E-6MG324C positions itself as a flexible, compact FPGA solution for designs that need reliable on-board programmability, substantial I/O count, and integrated memory resources. Its MachXO3 family architecture delivers system-level features—such as non-volatile configuration, hardened IP blocks and flexible clocking—convenient for a wide range of commercial embedded applications.

Choose this device when you require a commercially graded, RoHS-compliant FPGA with 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and 281 I/Os packaged in a 324‑VFBGA for high-density surface-mount implementations. It supports designs that value in-system updateability, compact board integration, and embedded system support as outlined in the MachXO3 family documentation.

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