LCMXO3LF-9400C-5BG400C

The LCMXO3LF-9400C-5BG400C is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a 400-ball low-profile FBGA package. It combines a flexible logic fabric with generous I/O and embedded memory, making it suitable for commercial embedded and system-control applications that require reconfigurable logic and extensive interfacing.

As a member of the MachXO3 family, the device provides non-volatile, multi-time programmable configuration and on-chip features such as programmable I/O, configurable clocking resources, and embedded system IP to help simplify board-level designs and reduce external component count.

Key Features

• Logic Capacity 9,400 logic elements for implementing glue logic, control functions and medium-complexity state machines.
• Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM suitable for FIFOs, buffering and small data tables.
• High I/O Count 335 I/O pins to support dense interfacing with peripherals, buses and sensors.
• Power and Supply Supported core and I/O supply range from 2.375 V to 3.465 V to match common commercial power rails.
• Package and Mounting 400-LFBGA (400-CABGA, 17×17) surface-mount package for compact board integration and high I/O density.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial embedded applications.
• Non-volatile, Multi-time Programmable Family-level capability for non-volatile configuration storage and reprogramming without external flash.
• Flexible On-chip Clocking and PLLs Integrated clocking resources and PLLs provide configurable clock distribution for synchronous designs.
• Programmable I/O and High-performance Buffers Flexible I/O buffer architecture and source-synchronous I/O support for varied interface standards and timing requirements.
• Embedded System IP Hardened IP blocks such as I²C, SPI, timers/counters and user flash memory (UFM) to accelerate common system functions.
• System-Level Features Family documentation highlights features like TransFR reconfiguration, standby/power-saving modes, and IEEE 1149.1 boundary scan support.
• Regulatory RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic High I/O count and flexible I/O buffering make the device suited for protocol conversion and board-level glue logic in commercial systems.
• Control and Sequencing The 9,400 logic elements and embedded RAM support control state machines, device sequencing, and local data handling.
• Human‑Machine Interface (HMI) and Display Control On-chip memory and configurable clocks help implement buffering and timing for user interfaces and display subsystems.
• Peripheral Aggregation Hardened SPI/I²C IP and abundant I/O simplify integration of multiple sensors and peripherals on a single FPGA-based controller.

Unique Advantages

• Highly integrated I/O and logic: 335 I/O pins paired with 9,400 logic elements enable consolidation of multiple discrete components into a single FPGA.
• Non‑volatile configuration: Multi-time programmable, on-chip configuration removes the need for external configuration flash in many designs.
• Embedded memory for buffering: Approximately 0.44 Mbits of RAM supports FIFOs and small data stores without external memory devices.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation to match typical commercial embedded deployments.
• Compact, high-density packaging: 400-LFBGA (17×17) package provides a balance of I/O density and board-area efficiency.
• On-chip system IP and clocking: Hardened I²C/SPI, timers/counters, PLLs and flexible clocking reduce design effort and BOM complexity.

Why Choose LCMXO3LF-9400C-5BG400C?

The LCMXO3LF-9400C-5BG400C positions itself as a commercial-grade, mid-density FPGA in the MachXO3 family that balances logic capacity, embedded memory and extensive I/O. Its non-volatile configuration, on-chip system IP and flexible clocking resources make it suitable for designs that need reliable reconfigurable logic and broad interfacing without adding external configuration or peripheral components.

This device is a fit for engineers developing commercial embedded systems where consolidating control, interface bridging and peripheral aggregation reduces PCB complexity and BOM. As part of the MachXO3 family, it benefits from documented system-level features and migration paths within the family.

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