LCMXO3LF-9400C-6BG256C

The LCMXO3LF-9400C-6BG256C is a MachXO3 family field-programmable gate array (FPGA) offering on-chip non-volatile configuration and flexible programmable logic. It combines 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and 206 I/O pins in a 256-LFBGA (14×14) package to address embedded control, I/O and system-level integration tasks.

Designed for commercial-grade applications, this device provides multi-time programmable, non-volatile configuration, on-chip clocking resources and hardened peripheral IP building blocks to support compact, integrated designs.

Key Features

• Logic Capacity — 9,400 logic elements provide the programmable fabric for custom control, glue logic and state-machine implementations.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for FIFOs, buffering and small data structures.
• Rich I/O — 206 I/O pins support diverse interfacing requirements and high pin-count system integration.
• Programmable Configuration — Non-volatile, multi-time programmable architecture and TransFR reconfiguration options (MachXO3 family features cited in datasheet).
• Clocking and Timing — On-chip oscillator and sysCLOCK Phase Locked Loops (PLLs) for flexible on-chip clock generation and distribution.
• Hardened IP Functions — Embedded hardened IP including I²C, SPI and timer/counter blocks for common peripheral tasks.
• Power and Supply Range — Supports supply voltages from 2.375 V to 3.465 V, enabling operation in a variety of system power domains.
• Package and Mounting — 256-LFBGA package (supplier device package: 256-CABGA, 14×14) for surface-mount board assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Interface bridging and I/O expansion — High I/O count and flexible I/O buffer architecture support source-synchronous and general-purpose interface tasks.
• System control and glue logic — 9,400 logic elements and non-volatile, multi-time programmable configuration enable system-level control and customized state machines.
• Peripheral and sensor interfacing — Hardened I²C and SPI IP cores simplify integration with sensors and peripherals while reducing external logic.
• On-board buffering and temporary storage — Approximately 0.44 Mbits of embedded RAM supports FIFOs, data buffering and small memory structures for real-time data flow.

Unique Advantages

• Integrated programmable logic and memory: 9,400 logic elements paired with approximately 0.44 Mbits of embedded RAM consolidates functionality that would otherwise require multiple discrete components.
• High pin count for system integration: 206 I/Os in a single 256-LFBGA package enable dense board-level connectivity and reduce PCB routing complexity.
• Non-volatile, reconfigurable platform: Multi-time programmable configuration supports iterative firmware updates and field reconfiguration without external configuration memory.
• Flexible clocking and timing: On-chip oscillator and PLL resources provide localized clock generation and distribution to simplify timing architectures.
• Hardened peripheral IP: Built-in I²C, SPI and timer/counter functions reduce BOM and accelerate development for common embedded interfaces.
• Commercial-grade, RoHS compliant: Designed for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial product requirements.

Why Choose LCMXO3LF-9400C-6BG256C?

The LCMXO3LF-9400C-6BG256C positions itself as a compact, reprogrammable platform that combines significant logic density, embedded memory and a high I/O count in a 256-LFBGA package. Its MachXO3 family architecture delivers non-volatile, multi-time programmable configuration, on-chip clocking, and hardened peripheral IP—features that help simplify board-level design and reduce component count.

This device is suited for engineers and teams building commercial embedded systems that require flexible I/O, local memory for buffering, and on-chip peripheral support. The combination of logic, RAM, I/O and integrated IP provides a scalable foundation for iterative development and system integration while maintaining standard commercial temperature and RoHS compliance.

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