LCMXO3LF-9400C-6BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 1,535 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3LF-9400C-6BG400C – MachXO3 Field Programmable Gate Array (FPGA), 9400 logic elements, 335 I/O, 400‑LFBGA
The LCMXO3LF-9400C-6BG400C is a MachXO3 family field-programmable gate array (FPGA) IC offering 9,400 logic elements and a high-density I/O complement in a compact 400‑LFBGA package. It combines programmable logic, embedded memory and hardened peripheral IP to support system glue logic, interface consolidation and configuration management in commercial-grade designs.
With 335 I/O pins, approximately 0.44 Mbits of on-chip RAM, support for on‑chip clocking and non-volatile, multi-time programmable configuration, this device targets applications that require flexible I/O, on-board configuration and integrated control functions within a 17 × 17 mm 400‑ball CABGA footprint.
Key Features
- Programmable Logic Fabric 9,400 logic elements organized across 1,175 logic array blocks provide the configurable fabric for custom logic functions and glue logic implementations.
- Embedded Memory Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for FIFOs, buffering and small local storage needs.
- High‑Density I/O 335 I/O pins enable broad connectivity for parallel interfaces, buses and peripheral control; the family documentation references pre‑engineered source synchronous I/O and flexible I/O buffer support.
- On‑Chip Clocking Flexible on‑chip clocking resources including sysCLOCK PLLs and an on‑chip oscillator provide clock generation and management options.
- Non‑Volatile Configuration & UFM Non‑volatile, multi‑time programmable configuration and user flash memory (UFM) support persistent configuration and field reprogramming workflows.
- Hardened Peripheral IP Embedded hardened IP functions such as I²C, SPI and timer/counter blocks reduce design overhead for common serial interfaces and control functions.
- Power & System Management Standby mode and power saving options are included in the family feature set to support reduced-power operating modes.
- Package & Mounting Surface-mount 400‑LFBGA (supplier package 400‑CABGA, 17 × 17 mm) for compact board layouts; RoHS compliant.
- Electrical & Environmental Supply voltage range 2.375 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.
Typical Applications
- Embedded control and glue logic Use the programmable fabric and abundant I/O to consolidate timing, control and interfacing tasks for complex embedded subsystems.
- Interface bridging and protocol conversion High I/O count and hardened serial IP (I²C, SPI) enable implementation of protocol bridges and bus adaptors on board.
- System configuration and management Non‑volatile configuration and user flash memory support device configuration, field updates and system management functions.
- Local buffering and signal processing Approximately 0.44 Mbits of embedded RAM supports FIFOs, small buffers and local data storage for timing-critical paths.
Unique Advantages
- Highly integrated solution: Combines programmable logic, embedded RAM and hardened IP to reduce component count and simplify BOM.
- Flexible connectivity: 335 I/O pins and flexible I/O buffer architecture enable wide-ranging interface support without external I/O expanders.
- Persistent, field‑friendly configuration: Non‑volatile, multi‑time programmable configuration plus UFM make updates and field reconfiguration straightforward.
- Compact package footprint: 400‑LFBGA (17 × 17 mm) package enables high-density board designs while preserving a high I/O count.
- Integrated clocking and timers: On‑chip PLLs and oscillator resources simplify clock distribution and timing management within the system.
- Commercial‑grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
Why Choose LCMXO3LF-9400C-6BG400C?
This MachXO3 family device balances a substantial logic resource (9,400 logic elements) with extensive I/O and embedded RAM in a space-efficient 400‑LFBGA package. Its combination of non‑volatile configuration, hardened serial/peripheral IP and integrated clocking resources makes it a pragmatic choice for designers needing on-board configuration, interface consolidation and local processing without adding multiple discrete components.
LCMXO3LF-9400C-6BG400C is well suited to commercial designs that demand flexible I/O routing, persistent configuration capability and compact board footprint, while offering design scalability through the MachXO3 family feature set and embedded system support documented in the device datasheet.
If you would like pricing, availability or to request a quote for the LCMXO3LF-9400C-6BG400C, please submit a quote request or contact sales with your part number and quantity requirements.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016