LCMXO3LF-9400C-6BG400C

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 1,535 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400C-6BG400C – MachXO3 Field Programmable Gate Array (FPGA), 9400 logic elements, 335 I/O, 400‑LFBGA

The LCMXO3LF-9400C-6BG400C is a MachXO3 family field-programmable gate array (FPGA) IC offering 9,400 logic elements and a high-density I/O complement in a compact 400‑LFBGA package. It combines programmable logic, embedded memory and hardened peripheral IP to support system glue logic, interface consolidation and configuration management in commercial-grade designs.

With 335 I/O pins, approximately 0.44 Mbits of on-chip RAM, support for on‑chip clocking and non-volatile, multi-time programmable configuration, this device targets applications that require flexible I/O, on-board configuration and integrated control functions within a 17 × 17 mm 400‑ball CABGA footprint.

Key Features

  • Programmable Logic Fabric  9,400 logic elements organized across 1,175 logic array blocks provide the configurable fabric for custom logic functions and glue logic implementations.
  • Embedded Memory  Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for FIFOs, buffering and small local storage needs.
  • High‑Density I/O  335 I/O pins enable broad connectivity for parallel interfaces, buses and peripheral control; the family documentation references pre‑engineered source synchronous I/O and flexible I/O buffer support.
  • On‑Chip Clocking  Flexible on‑chip clocking resources including sysCLOCK PLLs and an on‑chip oscillator provide clock generation and management options.
  • Non‑Volatile Configuration & UFM  Non‑volatile, multi‑time programmable configuration and user flash memory (UFM) support persistent configuration and field reprogramming workflows.
  • Hardened Peripheral IP  Embedded hardened IP functions such as I²C, SPI and timer/counter blocks reduce design overhead for common serial interfaces and control functions.
  • Power & System Management  Standby mode and power saving options are included in the family feature set to support reduced-power operating modes.
  • Package & Mounting  Surface-mount 400‑LFBGA (supplier package 400‑CABGA, 17 × 17 mm) for compact board layouts; RoHS compliant.
  • Electrical & Environmental  Supply voltage range 2.375 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.

Typical Applications

  • Embedded control and glue logic  Use the programmable fabric and abundant I/O to consolidate timing, control and interfacing tasks for complex embedded subsystems.
  • Interface bridging and protocol conversion  High I/O count and hardened serial IP (I²C, SPI) enable implementation of protocol bridges and bus adaptors on board.
  • System configuration and management  Non‑volatile configuration and user flash memory support device configuration, field updates and system management functions.
  • Local buffering and signal processing  Approximately 0.44 Mbits of embedded RAM supports FIFOs, small buffers and local data storage for timing-critical paths.

Unique Advantages

  • Highly integrated solution: Combines programmable logic, embedded RAM and hardened IP to reduce component count and simplify BOM.
  • Flexible connectivity: 335 I/O pins and flexible I/O buffer architecture enable wide-ranging interface support without external I/O expanders.
  • Persistent, field‑friendly configuration: Non‑volatile, multi‑time programmable configuration plus UFM make updates and field reconfiguration straightforward.
  • Compact package footprint: 400‑LFBGA (17 × 17 mm) package enables high-density board designs while preserving a high I/O count.
  • Integrated clocking and timers: On‑chip PLLs and oscillator resources simplify clock distribution and timing management within the system.
  • Commercial‑grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.

Why Choose LCMXO3LF-9400C-6BG400C?

This MachXO3 family device balances a substantial logic resource (9,400 logic elements) with extensive I/O and embedded RAM in a space-efficient 400‑LFBGA package. Its combination of non‑volatile configuration, hardened serial/peripheral IP and integrated clocking resources makes it a pragmatic choice for designers needing on-board configuration, interface consolidation and local processing without adding multiple discrete components.

LCMXO3LF-9400C-6BG400C is well suited to commercial designs that demand flexible I/O routing, persistent configuration capability and compact board footprint, while offering design scalability through the MachXO3 family feature set and embedded system support documented in the device datasheet.

If you would like pricing, availability or to request a quote for the LCMXO3LF-9400C-6BG400C, please submit a quote request or contact sales with your part number and quantity requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up