LCMXO3LF-9400C-6BG484I

IC FPGA 384 I/O 484CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA

Quantity 316 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-LFBGANumber of I/O384Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400C-6BG484I – MachXO3 Field Programmable Gate Array (FPGA) IC 384 I/O, ~0.42 Mbit RAM, 9,400 Logic Elements

The LCMXO3LF-9400C-6BG484I is a MachXO3 family FPGA offering a flexible, non-volatile programmable fabric with 9,400 logic elements and approximately 0.42 Mbits of embedded memory. Designed for industrial-grade applications, it provides a high-density I/O count and advanced on-chip system features in a compact 484-LFBGA package.

This device targets system designers who need reconfigurable logic, on-chip memory, and robust I/O capability—delivering integration and configurability for system control, interface bridging, and programmable glue logic within the specified industrial voltage and temperature ranges.

Key Features

  • Logic Fabric  9,400 logic elements provide programmable logic capacity for glue logic, protocol adaptation, and control functions.
  • Embedded Memory  Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
  • Rich I/O  384 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and flexible board-level interfacing.
  • Non-volatile, Multi-time Programmable  On-device non-volatile configuration allows multiple reconfiguration cycles without external flash, enabling field updates and design iteration.
  • Flexible On-Chip Clocking  Integrated clocking features including PLLs for system clock generation and deskewing as noted in the MachXO3 family architecture.
  • High-performance I/O and Source-Synchronous Support  Pre-engineered source-synchronous I/O and flexible I/O buffer options support diverse signalling requirements and timing arrangements.
  • Embedded Hardened IP  Family-level documentation lists hardened IP such as I²C, SPI and timer/counter blocks for offloading common system functions.
  • Configuration & Testability  Includes IEEE 1149.1-compliant boundary scan testability and device configuration support referenced in the family datasheet.
  • Package & Mounting  484-LFBGA (supplier package 484-CABGA, 19×19 mm) surface-mount package for compact board designs.
  • Industrial Operating Range  Voltage supply range 2.375 V to 3.465 V and operating temperature −40 °C to 100 °C for industrial environments.
  • Power Management & Reliability  Family-level features include standby mode and power saving options to support system-level power management strategies.
  • Compliance  Device is RoHS compliant.

Typical Applications

  • System Control and Glue Logic  Use the device’s 9,400 logic elements and plentiful I/O to implement board-level control, protocol translation, and interface aggregation.
  • Peripheral and Interface Bridging  The combination of flexible I/O buffers, pre-engineered source-synchronous I/O, and embedded memory supports buffering and bridging between peripheral buses.
  • Configuration and Field Reprogramming  Non-volatile, multi-time programmable configuration enables in-field updates and customization without external configuration flash.

Unique Advantages

  • High Logic Density: 9,400 logic elements deliver substantial programmable capacity for integration of control and interface logic into a single device.
  • Large I/O Count: 384 I/O pins reduce the need for external multiplexing and simplify board-level routing for complex systems.
  • Integrated Memory Resources: Approximately 0.42 Mbits of embedded RAM provide on-chip storage for FIFOs, buffers, and small lookup tables, reducing external memory dependence.
  • Industrial-ready Thermal and Voltage Range: Rated for −40 °C to 100 °C and a broad 2.375 V–3.465 V supply window for stable operation across industrial environments.
  • Compact, High-pin-count Package: 484-LFBGA (19×19 mm) enables high I/O density in space-constrained designs.
  • Testability and System Integration: IEEE 1149.1 boundary scan support and on-chip configuration features simplify manufacturing test and field servicing.

Why Choose LCMXO3LF-9400C-6BG484I?

The LCMXO3LF-9400C-6BG484I combines a non-volatile MachXO3 architecture with a balanced mix of logic, memory, and I/O to address industrial design needs where reconfigurability and system integration matter. Its combination of 9,400 logic elements, approximately 0.42 Mbits of embedded RAM, and 384 I/O pins supports consolidation of interface logic and control functions into a single programmable device.

This device is well suited for teams seeking a compact, RoHS-compliant FPGA solution in a 484-LFBGA package with industrial temperature and supply ranges, on-chip clocking and hardened IP building blocks documented in the MachXO3 family datasheet. It offers designers a configurable, field-updatable platform that aligns with industrial application requirements and system-level testability.

Request a quote or submit an inquiry to evaluate the LCMXO3LF-9400C-6BG484I for your next design and to obtain pricing and availability information.

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