LCMXO3LF-9400E-5BG400C

The LCMXO3LF-9400E-5BG400C is a MachXO3 family FPGA from Lattice Semiconductor. It provides a non-volatile, multi-time programmable logic platform with an architecture designed for flexible I/O, embedded memory, and on-chip peripheral support suitable for control, interfacing, and system management tasks.

With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and up to 335 user I/Os in a compact 400-LFBGA (400-CABGA, 17×17) package, this device targets applications that require high I/O density, configurable logic capacity, and on-chip peripheral integration within a commercial operating range.

Key Features

• Logic Capacity — 9,400 logic elements and 1,175 logic blocks provide ample programmable fabric for glue logic, state machines, and custom control functions.
• Embedded Memory — Approximately 442,368 bits (≈0.44 Mbits) of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described for the MachXO3 family.
• I/O Density & Flexibility — Up to 335 user I/Os with programmable I/O cells and flexible buffer options to support diverse interface standards and source-synchronous signaling.
• Clocking & Timing — Flexible on-chip clocking including sysCLOCK PLLs for clock conditioning and distribution across the fabric (family-level feature).
• On-chip Peripherals — Hardened IP functions referenced in the family datasheet such as I²C, SPI and timer/counter primitives, plus an on-chip oscillator and User Flash Memory (UFM).
• Non-volatile, Reconfigurable — Multi-time programmable non-volatile configuration for persistent designs and TransFR reconfiguration capabilities as part of the MachXO3 family feature set.
• Packaging & Mounting — 400-LFBGA surface-mount package (supplier package: 400-CABGA, 17×17) for space-efficient board integration.
• Power & Operating Range — Core supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• System Test & Reliability — Family-level support for IEEE 1149.1-compliant boundary scan, device configuration and traceID features for production test and system debug.
• Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — High I/O count and programmable I/O cells make the device well-suited for bridging disparate buses and aggregating signals between subsystems.
• System Control and Glue Logic — 9,400 logic elements provide capacity for custom control, sequencing, and finite-state machines used in embedded controller roles.
• Peripheral Aggregation — Embedded RAM and hardened I/O/IP cores (I²C, SPI, timers) enable local buffering, handling of peripheral interfaces, and offload of host processors.
• Configuration and Boot Management — Non-volatile, multi-time programmable configuration and UFM support system-level configuration storage and reconfiguration strategies.

Unique Advantages

• High I/O Density: 335 user I/Os provide designers with the flexibility to connect many peripherals, sensors, and external devices without external I/O expanders.
• Solid Logic Resource Mix: 9,400 logic elements and 1,175 logic blocks enable substantial programmable function implementation while keeping BOM complexity low.
• On-chip Memory Capabilities: Approximately 0.44 Mbits of embedded RAM supports FIFOs, buffering and small data stores directly on chip, reducing external memory needs.
• Integrated Peripherals and IP: Hardened I²C, SPI and timer/counter primitives along with an on-chip oscillator reduce the need for discrete peripherals and simplify software integration.
• Persistent, Reprogrammable Configuration: Multi-time programmable non-volatile configuration and TransFR reconfiguration enable in-field updates and adaptable system designs.
• Compact, Board-friendly Package: 400-LFBGA (400-CABGA, 17×17) surface-mount package balances density and manufacturability for compact embedded designs.

Why Choose LCMXO3LF-9400E-5BG400C?

The LCMXO3LF-9400E-5BG400C offers a balanced combination of logic capacity, on-chip memory, and a high number of user I/Os in a compact, RoHS-compliant package. Its MachXO3 family capabilities—non-volatile configuration, flexible clocking, hardened peripheral IP and production test support—make it a practical choice for designers building interface-rich, control-oriented embedded systems within a commercial temperature range.

This device is suited for engineering teams looking to consolidate peripheral components, accelerate board-level integration, and maintain reprogrammable configuration options for field updates. The combination of programmable fabric, embedded resources, and I/O flexibility supports scalable designs and long-term maintainability.

Request a quote or submit a pricing inquiry to evaluate the LCMXO3LF-9400E-5BG400C for your next design project.