LCMXO3LF-9400E-5BG484C

The LCMXO3LF-9400E-5BG484C is a MachXO3 family FPGA offering 9,400 logic elements and approximately 0.42 Mbits (442,368 bits) of embedded RAM. Built for commercial embedded designs, it provides a blend of programmable logic, on-chip memory and extensive I/O in a compact 484-LFBGA (19×19) package.

This device targets applications that require flexible I/O, non-volatile multi-time programmable configuration and moderate embedded memory, while operating from a 1.14 V to 1.26 V core supply within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 9,400 logic elements suitable for complex glue logic, state machines and mid-density FPGA functions; device architecture includes 1,175 logic array blocks equivalent partitioning.
• Embedded Memory — Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, FIFOs and small data structures and support for single/dual/pseudo-dual port and FIFO modes per MachXO3 family architecture.
• High I/O Density — 384 user I/Os enabling dense peripheral interfacing and signal routing across multiple banks.
• Configurable I/O and Performance — MachXO3 family features such as high-performance flexible I/O buffers, pre‑engineered source-synchronous I/O and programmable I/O cells for adaptable interface requirements.
• Non-volatile, Multi-time Programmable — On-chip non-volatile configuration with multi-time programming capability and TransFR reconfiguration support as part of the MachXO3 family feature set.
• Clocking and Timing — Integrated flexible on-chip clocking including PLLs for system clock management (described in the MachXO3 family documentation).
• Package and Mounting — 484-LFBGA (19×19) surface-mount package optimized for automated PCB assembly.
• Power and Operating Range — Core supply range from 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control and Glue Logic — Implement custom control logic, protocol translation and system glue functions using the device’s 9,400 logic elements and plentiful I/O.
• Peripheral and Interface Bridging — High I/O count supports bridging between multiple buses and peripherals in communications and industrial-facing commercial equipment.
• Prototyping and System Integration — Non-volatile, multi-time programmable configuration and on-chip RAM make this device suited for iterative development and integration into commercial embedded systems.

Unique Advantages

• Flexible integration density: 9,400 logic elements with 384 I/Os allow consolidation of multiple functions into a single device, reducing overall BOM complexity.
• On-chip memory for buffering: Approximately 0.42 Mbits of embedded RAM supports FIFOs and temporary storage without external memory.
• Non-volatile configuration: Multi-time programmable on-chip configuration removes the need for an external configuration flash in many designs.
• Compact, assembly-friendly package: 484-LFBGA (19×19) surface-mount format facilitates high-density board layouts and automated assembly workflows.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, making it appropriate for a wide range of commercial and consumer applications.
• Standards and family-level features: Leverages documented MachXO3 family capabilities such as flexible clocking, hardened IP blocks and programmable I/O behaviors described in the product datasheet.

Why Choose LCMXO3LF-9400E-5BG484C?

The LCMXO3LF-9400E-5BG484C positions itself as a mid-density, commercial-grade FPGA optimized for designs that require a balance of logic capacity, embedded memory and a high I/O count within a single, compact package. Its MachXO3 family features—non-volatile multi-time programmable configuration, flexible clocking and configurable I/O—make it suitable for integrating control, interface and buffering functions into commercial embedded systems.

Designers seeking a scalable, documented FPGA option with on-chip RAM and comprehensive I/O resources will find this device aligns with iterative development cycles and integration needs while benefiting from RoHS compliance and a well-described family architecture in the datasheet.

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