LCMXO3LF-9400E-5MG256I

The LCMXO3LF-9400E-5MG256I is a MachXO3 family field programmable gate array (FPGA) from Lattice Semiconductor. It combines programmable logic, embedded block memory, and a broad I/O complement in a compact 256-ball VFBGA/CSPBGA package targeted at industrial-grade designs.

Delivering 9,400 logic elements, approximately 0.44 Mbits of embedded memory, and 206 I/O pins, the device supports low-voltage operation (1.14 V–1.26 V) and an industrial operating range (−40 °C to 100 °C), making it suitable for system control, interface consolidation and configurable logic tasks within industrial equipment.

Key Features

• Core Logic  1,175 configurable logic blocks (CLBs) implementing a total of 9,400 logic elements for mid-density FPGA designs.
• Embedded Memory  Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for data buffering, state storage, and small FIFOs.
• I/O Capacity & Flexibility  206 I/O pins with support for pre-engineered source-synchronous I/O and flexible on-chip I/O buffering to support diverse interface requirements.
• Power & Voltage  Low-voltage core operation from 1.14 V to 1.26 V to match modern power rails and optimize system power design.
• Packaging & Mounting  256-VFBGA (CSPBGA) package, supplier package 256-CSFBGA (9×9), surface-mount mounting for compact PCB designs.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operating temperature to meet industrial application thermal requirements.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family architecture provides non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• On-chip System Features  Family-level features documented in the MachXO3 data sheet include flexible on-chip clocking (PLLs), on-chip oscillator, user flash memory (UFM), and embedded hardened IP blocks (I²C, SPI, timer/counter).
• System-level Support  Architecture-level features such as routing, clock/control distribution and memory modes are provided by the MachXO3 family documentation for predictable integration.
• RoHS Compliant  The device is RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Use as configurable logic and interface glue in industrial automation systems that require an industrial temperature range and compact packaging.
• Interface Bridging & Aggregation  Consolidate multiple I/O and protocol functions into a single device using the device’s flexible I/O and embedded memory resources.
• System Glue Logic  Implement custom control and timing logic between processors, sensors, and peripherals while preserving board space with the 256-VFBGA package.

Unique Advantages

• Balanced Logic Density:  9,400 logic elements with 1,175 CLBs provides a mid-density option for designs needing significant programmable logic without large form-factor devices.
• Substantial On-chip Memory:  Approximately 0.44 Mbits of embedded RAM enables local buffering, FIFOs and small data stores to reduce external memory dependence.
• High I/O Count:  206 I/O pins support complex interfacing and multiple peripheral connections from a single FPGA footprint.
• Industrial Reliability:  Industrial grade operating temperature and RoHS compliance align the device to ruggedized application environments.
• Non-volatile Configuration:  Multi-time programmable, non-volatile configuration simplifies field updates and system maintenance without external configuration ROM.
• Compact Package for Dense Boards:  256-ball VFBGA/CSPBGA (9×9) package supports space-constrained PCBs while retaining high pin count.

Why Choose LCMXO3LF-9400E-5MG256I?

The LCMXO3LF-9400E-5MG256I positions itself as a mid-density, industrial-grade MachXO3 FPGA that integrates a solid complement of logic, embedded memory and I/O in a compact 256-ball VFBGA package. Its low-voltage core and documented MachXO3 family system features—such as flexible clocking, on-chip oscillator, hardened peripheral IP and non-volatile multi-time programming—make it well suited for industrial control, interface consolidation, and system glue logic roles.

Designers seeking a reliable, documented FPGA option with predictable thermal range and a balance of logic, memory and I/O can leverage this part to reduce external components, simplify board-layout and maintain configurability for field updates.

Request a quote or submit an inquiry for the LCMXO3LF-9400E-5MG256I to obtain pricing and availability information.