LCMXO3LF-9400E-6BG400C

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 671 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O335Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400E-6BG400C – MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

The LCMXO3LF-9400E-6BG400C is a member of the MachXO3 family of FPGAs from Lattice Semiconductor Corporation. It combines a flexible, non-volatile FPGA architecture with on-chip memory, hardened peripheral IP, and a high I/O count to address programmable-logic requirements in commercial electronic systems.

This device targets applications that need configurable logic, embedded memory, multiple I/O standards and integrated system functions, while operating from a 1.14 V to 1.26 V supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 9,400 logic elements available for implementing custom logic, glue functions, and control paths.
  • Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for LUTs, FIFOs and small data buffers.
  • High I/O Count — 335 user I/Os to support dense peripheral connections and multiple interface domains.
  • Non-volatile, Multi-time Programmable — MachXO3 family architecture provides non-volatile configuration and multi-time programmability as outlined in the family data sheet.
  • Hardened Peripheral IP — Integrated hardened IP blocks called out in the MachXO3 data sheet, including I²C, SPI and timer/counter functions to simplify system design.
  • Flexible On-chip Clocking — Clocking features such as phase-locked loops (PLLs) and on-chip oscillator support flexible clock architectures (see family data sheet).
  • Programmable I/O and Source-Synchronous Support — High performance, flexible I/O buffer and pre‑engineered source-synchronous I/O capabilities are provided by the MachXO3 family.
  • Configuration and System Support — Features such as TransFR reconfiguration, user flash memory (UFM), standby mode and IEEE 1149.1-compliant boundary scan are included in the family-level specification.
  • Package and Mounting — Surface-mount 400-LFBGA package (supplier designation 400-CABGA, 17 × 17) for compact board integration.
  • Power and Thermal — Core supply range 1.14 V to 1.26 V; commercial-grade operating temperature from 0 °C to 85 °C.
  • RoHS Compliant — Device is RoHS status compliant.

Typical Applications

  • Interface Bridging and Protocol Conversion — Use the device’s programmable logic and high I/O count to implement protocol translation, bus bridging and signal aggregation.
  • System Control and Glue Logic — Implement power sequencing, reset logic, supervisory control and custom state machines using the device’s logic elements and embedded memory.
  • Peripheral Management — Leverage hardened I²C, SPI and timer/counter blocks to manage sensors, actuators and board-level peripherals.
  • User Interface and Display Control — Drive multiplexed interfaces and handle interface timing with flexible I/O and on-chip clocking resources.

Unique Advantages

  • High integration density: 9,400 logic elements and approximately 0.44 Mbits of embedded RAM reduce external logic and memory needs.
  • Large I/O availability: 335 user I/Os support multiple peripherals and parallel interfaces without extensive board-level multiplexing.
  • Integrated system IP: Hardened I²C, SPI and timer/counter functions simplify firmware and reduce development time.
  • Non-volatile configuration: Multi-time programmable, non-volatile configuration provides persistent device behavior across power cycles as described in the MachXO3 family data sheet.
  • Compact packaging: 400-LFBGA (17 × 17) package enables dense board layouts while maintaining robust routing options.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a wide range of commercial applications.

Why Choose LCMXO3LF-9400E-6BG400C?

The LCMXO3LF-9400E-6BG400C combines a MachXO3 family feature set—non-volatile programmability, flexible on-chip clocking, hardened peripheral IP and programmable I/O—with a substantial logic element count and a high number of user I/Os. This balance of integration, configurability and I/O density makes it well suited for commercial designs that require customizable logic, interface consolidation and on-board peripheral control.

Engineers building control logic, interface bridges, peripheral management functions or user-interface controllers will find the device’s on-chip resources and package options beneficial for compact, maintainable designs that align with the MachXO3 family architecture and support model.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO3LF-9400E-6BG400C. Our team can provide lead-time details and help with volume pricing and technical questions.

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