LCMXO3LF-9400E-6BG484C

The LCMXO3LF-9400E-6BG484C is a MachXO3 family Field Programmable Gate Array (FPGA) offering 9,400 logic elements and extensive I/O capability. It combines on-chip embedded memory, programmable I/O, and family-level system features to support a broad range of configurable digital functions.

This surface-mount, commercial-grade device provides 384 user I/O, approximately 0.44 Mbits of embedded RAM, and non-volatile, multi-time programmable configuration in a 484-LFBGA package, making it suitable for compact system designs that require moderate logic capacity and high I/O density.

Key Features

• Logic Capacity — 9,400 logic elements organized into 1,175 CLBs, enabling implementation of medium-complexity programmable logic and glue functions.
• Embedded Memory — 442,368 total RAM bits (approximately 0.44 Mbits) of on-chip RAM for state storage, FIFOs, and small buffers.
• I/O Density — 384 user I/O pins with pre-engineered source-synchronous and flexible I/O buffer support as described in the MachXO3 family documentation.
• Non-volatile Configuration — MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• Clocking and Timing — Family-level architecture includes on-chip PLLs and flexible clock distribution to support various clocking schemes.
• Embedded IP and Peripherals — Family documentation lists hardened IP functions such as I²C and SPI cores, timers/counters, and on-chip oscillator options.
• Power and Voltage — VCC core supply range: 1.14 V to 1.26 V, with power-saving and standby modes referenced in the MachXO3 family documentation.
• Package and Mounting — 484-LFBGA (supplier package: 484-CABGA, 19 × 19 mm), surface-mount assembly.
• Operating Conditions — Commercial grade with specified operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• I/O Expansion and Interface Logic — Use the device’s 384 programmable I/O pins and flexible I/O buffer architecture to implement custom interface logic and signal translation.
• Glue Logic and Control Functions — The combination of 9,400 logic elements and on-chip RAM supports glue logic, control sequencing, and moderate embedded control tasks.
• Protocol Bridging and Peripheral Integration — Embedded hardened IP options (I²C, SPI) and programmable logic allow integration and bridging of on-board peripherals and serial interfaces.
• Low-power and Standby Applications — Family-level standby and power-saving features allow the device to be used in designs where reduced power modes are required.

Unique Advantages

• High I/O Count in a Compact Package — 384 I/O pins in a 484-LFBGA (19 × 19 mm) package provides substantial connectivity for constrained board space.
• Ready-to-Configure Non-volatile Logic — Multi-time programmable, non-volatile configuration removes the need for external configuration memory for many system architectures.
• Balanced Logic and Memory Resources — 9,400 logic elements paired with approximately 0.44 Mbits of embedded RAM support a variety of moderate-complexity designs without external RAM.
• Integrated Timing Resources — On-chip PLLs and flexible clock distribution (as described in MachXO3 family documentation) simplify clock-domain management.
• Commercial Temperature and RoHS Compliance — Operates across 0 °C to 85 °C and meets RoHS requirements for lead-free compliance.
• Surface-Mount Manufacturing Compatibility — 484-LFBGA surface-mount package fits standard PCB assembly processes for compact production designs.

Why Choose LCMXO3LF-9400E-6BG484C?

The LCMXO3LF-9400E-6BG484C positions itself as a mid-density, highly connected FPGA option within the MachXO3 family. With 9,400 logic elements, approximately 0.44 Mbits of embedded memory, and 384 I/O, it is well suited to designs that require substantial I/O and on-chip resources without external configuration storage.

Choosing this part provides access to MachXO3 family capabilities—non-volatile multi-time programmability, embedded IP blocks (I²C, SPI, timers), flexible clocking and PLLs, and power-saving modes—delivered in a compact 484-LFBGA package for commercial-grade applications operating from 0 °C to 85 °C.

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