LCMXO640C-3B256C

The LCMXO640C-3B256C is a MachXO family FPGA optimized for glue logic, bus bridging, power-up control and general control logic. The device combines non-volatile, instant-on architecture with a compact package and high I/O count to address board-level control and interfacing tasks in commercial applications.

Key attributes include 640 logic elements, up to 159 I/Os in a 256-ball package, flexible I/O support and on-chip configurability—providing a single-chip, reconfigurable solution for system integration and in-field updates.

Key Features

• Core Logic  Approximately 640 logic elements for implementing glue logic, state machines and bus adapters.
• Memory  Distributed RAM support per MachXO family specifications (family-level distributed RAM of up to 6.1 Kbits is supported for the LCMXO640 device).
• I/O and Package  159 I/Os in a 256-ball package (256-LFBGA / 256-CABGA, 14×14 mm supplier package). Multiple package options and high I/O-to-logic density simplify board routing for dense interfaces.
• Non-Volatile, Instant-On Configuration  Single-chip, non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory; supports background programming and JTAG-based non-volatile programming.
• In-Field Reconfiguration  TransFR™ reconfiguration and SRAM reconfiguration options allow logic updates while the system operates (family-level feature).
• Flexible I/O Standards  Family-level sysIO buffer support for a wide range of interfaces including multiple LVCMOS levels, LVTTL, PCI, LVDS and other differential standards.
• Power and Voltage  Device supply range 1.71 V to 3.465 V, enabling compatibility with a variety of system power rails.
• Low-Power Modes  Sleep mode capability available (family-level), allowing significant static current reduction during idle periods.
• Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant packaging.
• System Support  Family-level support for IEEE 1149.1 boundary scan and IEEE 1532 in-system programming; JTAG programmability is supported.

Typical Applications

• Glue Logic and Board Control  Implement address decoding, bus arbitration, reset and power sequencing with instant-on non-volatile logic.
• Bus Bridging and Interfacing  High I/O density and flexible I/O standards support bridging between diverse bus voltages and signaling standards.
• Power-Up and System Sequencing  Use the device’s single-chip configuration and sleep modes to manage power-up sequences and reduce standby current.
• Control and State Machines  Ideal for implementing control logic, protocol handling and system supervision functions in compact commercial designs.

Unique Advantages

• Instant-on Non-Volatile Logic:  Single-chip non-volatile configuration provides immediate functionality at power-up without external memory.
• High I/O-to-Logic Density:  159 I/Os paired with 640 logic elements enable complex interfacing in a compact package footprint.
• In-Field Reconfigurability:  TransFR reconfiguration and background programming allow updates to logic while systems are operational, simplifying field upgrades.
• Flexible I/O Standards:  Programmable I/O buffers support multiple signaling standards to reduce the need for level shifters and glue components.
• Compact, RoHS-Compliant Packaging:  256-ball caBGA / LFBGA packaging provides a small footprint with commercial-grade environmental compliance.

Why Choose LCMXO640C-3B256C?

The LCMXO640C-3B256C is positioned as a compact, reconfigurable solution for commercial applications that need reliable board-level control, interface bridging and instant-on operation. With 640 logic elements, 159 I/Os in a 256-ball package, and MachXO family capabilities such as non-volatile configuration and in-field reprogramming, it simplifies BOM and design complexity for space-constrained systems.

This device suits designers seeking a single-chip, reprogrammable control element with flexible I/O and established family-level system features. Its commercial operating range and RoHS-compliant packaging make it appropriate for a wide range of commercial embedded designs.

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