LCMXO640C-3BN256I

The LCMXO640C-3BN256I is a MachXO family field programmable gate array (FPGA) from Lattice Semiconductor, offered in a 256-ball LFBGA/CABGA (14×14 mm) surface-mount package. It delivers 640 logic elements and up to 159 I/O for compact glue-logic, control and bus-bridging tasks in industrial applications.

Designed for single-chip, instant-on implementations, this industrial-grade device supports non-volatile configuration and in-field reconfiguration while operating across a broad supply and temperature range, making it suitable for systems requiring fast start-up and durable operation.

Key Features

• Core Logic — 640 logic elements (LUTs) provide the programmable fabric for implementing glue logic, protocol bridging, and control-state machines.
• Memory — Approximately 6.1 Kbits of distributed RAM (MachXO family specification for the LCMXO640 device) for small FIFOs, registers, and buffering within logic.
• I/O Capacity — 159 I/O pins in the 256-ball package enable high pin-to-pin connectivity for system interfacing and board-level integration.
• Non-volatile, Instant-on Configuration — Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory and supports in-field reconfiguration.
• Power Management — Sleep mode capability reduces static current (family feature) to lower standby power in battery-assisted or energy-conscious systems.
• In-field Reconfiguration — TransFR reconfiguration supports updates to device logic while the system remains operational (MachXO family feature).
• Flexible Supply Range — Operates across a wide supply range (1.71 V to 3.465 V) to accommodate multiple I/O standards and system rails.
• Package & Temperature — 256-LFBGA (256-CABGA 14×14 mm) surface-mount package; industrial operating temperature range of −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Glue Logic & System Control — Replace discrete combinational logic and small state machines to simplify PCB design and reduce BOM.
• Bus Bridging and Interface Conversion — Implement protocol adapters and bus translators using the device’s logic and abundant I/O.
• Power-Up and Reset Management — Implement deterministic power-up sequencing and control functions that benefit from instant-on configuration.
• Embedded Control in Industrial Equipment — Handle board-level control, sensor interfacing, and peripheral management within industrial temperature ranges.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and reduces system boot time and complexity.
• Reconfigurable in-field: TransFR support enables logic updates while the system remains active, reducing downtime for firmware/logic changes.
• High I/O density in a compact package: 159 I/Os in a 256-ball BGA provide extensive connectivity for complex board-level interfacing without large packages.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Reduced BOM and simplified designs: On-chip configuration and integrated fabric reduce the need for external components and simplify system design.
• Design tool support: MachXO family devices are supported by ispLEVER design tools (family-level information) to aid synthesis, place-and-route, and timing verification.

Why Choose LCMXO640C-3BN256I?

The LCMXO640C-3BN256I positions itself as a compact, industrial-grade MachXO FPGA that balances programmable logic capacity with high I/O density and single-chip configuration. Its combination of 640 logic elements, distributed RAM, and 159 I/Os in a 256-ball BGA package makes it a strong choice for designers replacing discrete logic, implementing bus bridges, or consolidating board-level control functions.

With instant-on non-volatile configuration, in-field reconfiguration options, and supported design tools, this device offers a practical path to reduce BOM, accelerate system start-up, and simplify long-term maintenance of FPGA-enabled systems.

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