LCMXO640C-3FT256C

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 10 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-3FT256C – MachXO FPGA, 640 logic elements, 159 I/Os, 256-LBGA

The LCMXO640C-3FT256C is a MachXO family field-programmable gate array (FPGA) delivered in a 256-ball BGA package optimized for space-constrained surface-mount applications. It combines a non-volatile configuration architecture with a mid-range logic capacity of 640 logic elements and up to 159 user I/Os, making it suitable for glue logic, bus interfacing and control tasks across commercial electronics designs.

Designed for single-chip configuration and quick start-up, the device targets applications that need compact, reconfigurable logic with flexible I/O and broad supply voltage support from 1.71 V to 3.465 V.

Key Features

  • Core Logic 640 logic elements provide mid-range programmable logic capacity for glue logic, control and interfacing functions.
  • Memory Family datasheet indicates distributed on-chip RAM resources for this density; consult product documentation for memory details specific to design needs.
  • I/O Density & Flexibility Up to 159 I/Os in the 256-ball package enable extensive external interfacing and signal routing in a compact footprint.
  • Non-volatile, Instant-on Configuration MachXO family architecture supports single-chip, non-volatile configuration that powers up in microseconds without external configuration memory.
  • In-field Reconfiguration TransFR™ reconfiguration support in the MachXO family allows updates to SRAM-based logic while the system is operating (family-level feature).
  • Low-Power Modes Family-level Sleep Mode can reduce static current by up to 100×, enabling lower-power standby operation where applicable.
  • Supply Voltage Range Operates across a wide supply range from 1.71 V to 3.465 V to support multiple I/O voltage families.
  • Package & Mounting 256-LBGA / supplier package 256-FTBGA (17×17 mm) for surface-mount assembly, balancing I/O count and board area.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature for commercial applications.
  • RoHS Compliant Device is RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

  • Glue Logic and System Control Implement board-level control, power-up sequencing and system glue logic with a compact, single-chip FPGA.
  • Bus Bridging and Interfacing Bridge and translate between bus standards or manage complex I/O routing using the device's abundant I/Os and programmable logic.
  • Peripheral and Sensor Interfaces Manage sensor aggregation, signal conditioning logic and peripheral control functions where reconfigurability and fast startup are beneficial.
  • Embedded Control Functions Replace fixed-function logic for control tasks with field-reconfigurable logic to support in-field updates and iterative development.

Unique Advantages

  • Instant-on, Single-chip Configuration: Non-volatile configuration eliminates the need for external configuration memory and enables microsecond-scale power-up.
  • Mid-range Logic with High I/O Count: 640 logic elements paired with 159 I/Os provide a balanced platform for designs needing moderate logic and extensive connectivity.
  • Flexible Voltage Support: Wide supply range (1.71 V–3.465 V) accommodates multiple I/O voltage domains without additional power conversion for many use cases.
  • Compact BGA Package: 256-ball ftBGA (17×17 mm) packaging delivers high pin density in a space-efficient surface-mount form factor.
  • Field Reconfiguration Capability: Family-level TransFR reconfiguration enables in-field logic updates while preserving system operation.
  • Regulatory and Assembly Readiness: RoHS compliant and surface-mount packaged for modern lead-free assembly processes.

Why Choose LCMXO640C-3FT256C?

The LCMXO640C-3FT256C positions itself as a compact, non-volatile FPGA option for commercial embedded designs that require moderate logic resources and a high I/O count in a single-chip solution. Its instant-on configuration, wide supply voltage support and surface-mount 256-ball BGA package make it well suited for space- and power-constrained applications that benefit from reconfigurable logic and in-field updates.

For engineers and procurement teams developing control, interfacing or glue-logic functions, the device delivers a predictable, reconfigurable platform backed by MachXO family capabilities and RoHS-compliant packaging.

Request a quote or submit an inquiry to get pricing, availability and more details for LCMXO640C-3FT256C for your next design.

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