LCMXO640C-3FTN256C

IC FPGA 159 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

Quantity 555 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-3FTN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

The LCMXO640C-3FTN256C is a MachXO family FPGA optimized for glue logic, bus bridging, power-up control and general-purpose control logic. It combines non-volatile configuration and fast start-up behavior with a compact 256-ball BGA package and a high I/O-to-logic density suitable for space-constrained embedded systems and commercial designs.

This device delivers 640 logic elements, up to 159 I/O pins, and device-level support for flexible supply voltages, enabling integrated control and interfacing functions without external configuration memory.

Key Features

  • Logic Capacity — 640 logic elements to implement glue logic, state machines and control functions efficiently.
  • I/O Density — Up to 159 I/Os in the 256-ball package to support wide peripheral and bus connectivity.
  • Non-volatile, Instant-On Architecture — MachXO family features include single-chip non-volatile configuration and microsecond-scale start-up for immediate system responsiveness.
  • Reconfiguration and In-field Updates — Family-level features include TransFR™ reconfiguration and background programming of non-volatile memory for in-field logic updates while the system operates.
  • Memory — Distributed RAM approximately 6.1 Kbits (MachXO640 family); no embedded block SRAM (EBR) in this device.
  • Power and Voltage — Device-level supply range: 1.71 V to 3.465 V. MachXO family supports standard VCC options across common logic rails.
  • Package & Mounting — Surface-mount 256-LBGA; supplier device package described as 256-FTBGA (17×17 mm).
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
  • Low Power Modes — Family-level sleep mode capability to substantially reduce static current during standby.
  • Standards & Compliance — Lead-free/RoHS compliant packaging as part of the MachXO family offering.

Typical Applications

  • Glue Logic & Bus Interfacing — Implement address decoding, protocol translation and bus bridging between subsystems where compact logic and high I/O count are required.
  • Power-up and Reset Control — Provide deterministic, instant-on control for system power sequencing and safe start-up without external configuration memory.
  • Peripheral and Sensor Aggregation — Aggregate and condition signals from multiple sensors or peripherals using available I/Os and distributed memory for buffering.
  • System Control Logic — Implement state machines, multiplexing, and control interfaces in compact embedded systems and commercial electronics.

Unique Advantages

  • Single-chip, Non-volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale startup.
  • High I/O-to-Logic Ratio: 159 I/Os paired with 640 logic elements simplify integration of multiple interfaces in one device.
  • In-field Reconfiguration: Background programming and family TransFR™ capabilities allow logic updates without taking the entire system offline.
  • Compact BGA Package: 256-ball BGA footprint delivers high pin count in a small area for board space-constrained designs.
  • Commercial Temperature and RoHS Compliance: Designed for commercial applications with RoHS-compliant packaging for global deployment.
  • Tool Support: MachXO family design flow (ispLEVER) is available for synthesis, place-and-route and timing analysis to streamline development.

Why Choose LCMXO640C-3FTN256C?

The LCMXO640C-3FTN256C is positioned for commercial embedded designs that require instant-on, non-volatile FPGA functionality with a strong I/O complement and compact packaging. With 640 logic elements and up to 159 I/Os in a 256-ball BGA, it provides a balanced platform for control, interfacing and glue-logic tasks without external configuration components.

Designers benefit from MachXO family features such as background non-volatile programming, sleep mode for reduced static current, and an established design tool flow to accelerate implementation and iteration. This device is suited to teams seeking integration, predictable start-up behavior and board-area efficiency in commercial temperature applications.

Request a quote or submit an inquiry to check pricing and availability for the LCMXO640C-3FTN256C and to discuss how it fits your next embedded or interfacing design.

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