LCMXO640C-3FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 555 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-3FTN256C – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA
The LCMXO640C-3FTN256C is a MachXO family FPGA optimized for glue logic, bus bridging, power-up control and general-purpose control logic. It combines non-volatile configuration and fast start-up behavior with a compact 256-ball BGA package and a high I/O-to-logic density suitable for space-constrained embedded systems and commercial designs.
This device delivers 640 logic elements, up to 159 I/O pins, and device-level support for flexible supply voltages, enabling integrated control and interfacing functions without external configuration memory.
Key Features
- Logic Capacity — 640 logic elements to implement glue logic, state machines and control functions efficiently.
- I/O Density — Up to 159 I/Os in the 256-ball package to support wide peripheral and bus connectivity.
- Non-volatile, Instant-On Architecture — MachXO family features include single-chip non-volatile configuration and microsecond-scale start-up for immediate system responsiveness.
- Reconfiguration and In-field Updates — Family-level features include TransFR™ reconfiguration and background programming of non-volatile memory for in-field logic updates while the system operates.
- Memory — Distributed RAM approximately 6.1 Kbits (MachXO640 family); no embedded block SRAM (EBR) in this device.
- Power and Voltage — Device-level supply range: 1.71 V to 3.465 V. MachXO family supports standard VCC options across common logic rails.
- Package & Mounting — Surface-mount 256-LBGA; supplier device package described as 256-FTBGA (17×17 mm).
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
- Low Power Modes — Family-level sleep mode capability to substantially reduce static current during standby.
- Standards & Compliance — Lead-free/RoHS compliant packaging as part of the MachXO family offering.
Typical Applications
- Glue Logic & Bus Interfacing — Implement address decoding, protocol translation and bus bridging between subsystems where compact logic and high I/O count are required.
- Power-up and Reset Control — Provide deterministic, instant-on control for system power sequencing and safe start-up without external configuration memory.
- Peripheral and Sensor Aggregation — Aggregate and condition signals from multiple sensors or peripherals using available I/Os and distributed memory for buffering.
- System Control Logic — Implement state machines, multiplexing, and control interfaces in compact embedded systems and commercial electronics.
Unique Advantages
- Single-chip, Non-volatile Configuration: Eliminates the need for external configuration memory and enables microsecond-scale startup.
- High I/O-to-Logic Ratio: 159 I/Os paired with 640 logic elements simplify integration of multiple interfaces in one device.
- In-field Reconfiguration: Background programming and family TransFR™ capabilities allow logic updates without taking the entire system offline.
- Compact BGA Package: 256-ball BGA footprint delivers high pin count in a small area for board space-constrained designs.
- Commercial Temperature and RoHS Compliance: Designed for commercial applications with RoHS-compliant packaging for global deployment.
- Tool Support: MachXO family design flow (ispLEVER) is available for synthesis, place-and-route and timing analysis to streamline development.
Why Choose LCMXO640C-3FTN256C?
The LCMXO640C-3FTN256C is positioned for commercial embedded designs that require instant-on, non-volatile FPGA functionality with a strong I/O complement and compact packaging. With 640 logic elements and up to 159 I/Os in a 256-ball BGA, it provides a balanced platform for control, interfacing and glue-logic tasks without external configuration components.
Designers benefit from MachXO family features such as background non-volatile programming, sleep mode for reduced static current, and an established design tool flow to accelerate implementation and iteration. This device is suited to teams seeking integration, predictable start-up behavior and board-area efficiency in commercial temperature applications.
Request a quote or submit an inquiry to check pricing and availability for the LCMXO640C-3FTN256C and to discuss how it fits your next embedded or interfacing design.