LCMXO640C-3M132C

The LCMXO640C-3M132C is a MachXO family field programmable gate array (FPGA) offered in a 132-ball LFBGA/CSPBGA package. It delivers 640 logic elements and 101 I/O pins in a surface-mount, commercial-grade device designed for control, glue-logic and interfacing roles where instant-on, non-volatile configuration and flexible I/O are important.

Built on the MachXO architecture, the device combines non-volatile instant-on operation, in-field reconfiguration capabilities and a high I/O-to-logic density to address glue logic, bus bridging and system control applications in compact board designs.

Key Features

• Core Logic  640 logic elements (cells) provide the programmable fabric for implementing glue logic, control state machines and bus interfacing functions.
• I/O Capacity & Flexibility  101 user I/Os in a 132-ball package offer broad pin access for signal routing and peripheral interfacing.
• Non‑volatile Instant‑On Configuration  MachXO family architecture supports single-chip, non-volatile configuration allowing instant-on operation without external configuration memory.
• In‑Field Reconfiguration  Supports background and in-field reprogramming (TransFR™ Reconfiguration) for logic updates while the system runs.
• Programmable I/O Standards  MachXO family sysIO buffer supports multiple interface standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, RSDS) to accommodate diverse board-level interfaces.
• Power and Low‑Power Modes  Device supports a Sleep Mode that can reduce static current significantly for lower-power standby operation.
• Voltage Range  Operates across a wide supply range of 1.71 V to 3.465 V to support mixed-voltage systems.
• Package & Mounting  132-LFBGA / 132-CSPBGA (8×8 mm) surface-mount package for compact, high-density PCB designs.
• Commercial Temperature Grade  Specified operating temperature range of 0 °C to 85 °C for commercial applications.
• Compliance  RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control  Implement board-level glue logic, reset and power sequencing, and compact control-state machines using the device’s programmable fabric.
• Bus Bridging & Interfacing  Use the flexible sysIO buffer and abundant I/O to bridge between different bus standards and voltage domains.
• Peripheral and Sensor Aggregation  Aggregate and manage multiple peripheral signals or sensors with compact, programmable logic and reconfiguration capability.
• Field Updatable Logic  Update or patch logic in the field using background programming and TransFR reconfiguration without full system downtime.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates the need for external configuration memory and provides rapid start-up.
• Compact high-density package: 132-ball CSPBGA in an 8×8 mm footprint offers a small board area for designs requiring many I/Os in a compact form factor.
• Flexible voltage support: Wide supply range (1.71 V–3.465 V) simplifies integration in mixed-voltage systems.
• In-field reconfiguration: TransFR and background programming enable logic updates while maintaining system operation, reducing maintenance disruptions.
• Commercial-grade suitability: Specified for 0 °C to 85 °C operation and RoHS-compliant packaging for mainstream electronics applications.
• Rich interface support: MachXO-family programmable I/O buffers support common signaling standards to ease board-level integration.

Why Choose LCMXO640C-3M132C?

The LCMXO640C-3M132C positions itself as a compact, non-volatile MachXO FPGA option for designers needing instant-on, reconfigurable logic with a strong I/O presence in a small package. Its 640 logic elements and 101 I/Os in a 132-ball CSPBGA package make it a practical choice for glue logic, bus interfacing, and control applications where board space and quick startup matter.

Backed by MachXO family features such as in-field reconfiguration, sleep mode for reduced standby current, and broad I/O standard support, this device provides a focused, reliable option for commercial embedded designs that require flexible, reprogrammable logic with straightforward supply and thermal specifications.

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