LCMXO640C-3MN100C

The LCMXO640C-3MN100C is a MachXO family FPGA optimized for glue-logic, bus interfacing and system control tasks. It delivers 640 logic elements in a non-volatile, instant-on architecture that eliminates the need for external configuration memory and supports in-field reconfiguration.

With 74 user I/Os in a compact 100-ball BGA package, flexible programmable I/O standards, and a wide supply range, this device targets board-level control, protocol bridging and power-up management in commercial-temperature applications.

Key Features

• Core Logic — 640 logic elements for implementing glue logic, control paths and interface translation without external programmable devices.
• Non-volatile, Instant-on Architecture — Single-chip configuration; instant-on operation and no external configuration memory required for secure, fast system start-up.
• Reconfiguration and In-field Updates — Support for reconfiguring SRAM-based logic in milliseconds and TransFR™ (background reconfiguration) for in-field logic updates while the system operates.
• Memory — Distributed RAM available in the MachXO640 family (as documented for this family); this device does not include embedded block SRAM (EBR) blocks.
• Flexible I/O — 74 I/O pins with programmable sysIO buffer support for a wide range of interfaces as documented for the MachXO family (LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS and multiple supply voltages).
• Power and Low-Power Modes — Operates across a broad supply range (1.71 V to 3.465 V) and includes a Sleep Mode that can reduce static current by up to 100×.
• System-Level Support — IEEE 1149.1 boundary scan, JTAG programmability and IEEE 1532-compliant in-system programming for board-level test and field updates; includes onboard oscillator.
• Package and Temperature — 100-ball LFBGA / csBGA (8×8 mm) surface-mount package; commercial-grade operating range 0 °C to 85 °C; RoHS-compliant.

Typical Applications

• Glue Logic and System Glue — Replace discrete combinational logic and small CPLDs for board-level signal routing, pin multiplexing and protocol translation.
• Bus Bridging and Interface Conversion — Implement bus bridging and level-shifting logic between subsystems using the programmable I/O and multiple supported interface standards.
• Power-Up and Reset Control — Centralize power sequencing, reset distribution and startup control with instant-on configuration and deterministic behavior at power-up.
• Peripheral and Sensor Interfacing — Aggregate and condition signals from peripherals or sensors, implement custom state machines and handle I/O timing in a compact package.
• Field-Upgradeable Logic — Enable in-field updates and background reconfiguration for firmware-like hardware changes without removing the device.

Unique Advantages

• Single-Chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout while providing instant-on behavior.
• Flexible I/O and Wide Supply Range: Supports multiple interface standards and a supply range from 1.71 V to 3.465 V, enabling integration with a variety of subsystem voltage domains.
• Compact, Surface-Mount Package: 100-ball BGA (8×8 mm) reduces board area for space-constrained designs while exposing 74 usable I/Os.
• Low-Power Options: Sleep Mode can dramatically reduce static current for power-sensitive applications.
• Field Reconfigurability: Background reconfiguration and JTAG-based programming let you update logic in-system with minimal downtime.
• Design Tool Support: MachXO family support in the vendor’s design flow enables efficient entry, place-and-route and timing verification for complex designs.

Why Choose LCMXO640C-3MN100C?

The LCMXO640C-3MN100C positions itself as a compact, non-volatile FPGA for designers who need instant-on behavior, flexible I/O handling and moderate logic density without external configuration components. Its single-chip architecture, broad supply compatibility and reconfiguration capabilities make it well suited for board-level control, protocol bridging and system sequencing in commercial-temperature products.

Designed for easy migration within the MachXO family and supported by established design tools, this device offers a practical balance of integration, configurability and package density for teams looking to reduce BOM complexity and accelerate time-to-market.

Request a quote or submit a pricing inquiry today to evaluate the LCMXO640C-3MN100C for your next design.