LCMXO640C-3M132I

The LCMXO640C-3M132I is a MachXO family non-volatile FPGA optimized for glue logic, bus interfacing and control functions. It integrates 640 logic elements with 101 I/Os in a 132-ball CSPBGA (8×8 mm) surface-mount package, offering instant-on single-chip configuration and a compact footprint for space-constrained systems.

Designed for industrial environments, the device operates from 1.71 V to 3.465 V and across an ambient range of –40 °C to 100 °C, delivering reconfigurable logic and flexible I/O for board-level control, bridging and sequencing applications.

Key Features

• Logic Density — 640 logic elements provide programmable combinational and sequential resources for glue logic, control and interfacing tasks.
• I/O Count & Package — 101 user I/Os in a 132-ball CSPBGA (8×8 mm) surface-mount package, enabling dense connectivity in a small footprint.
• Non-volatile, Single-chip Configuration — MachXO family architecture supports instant-on operation with no external configuration memory required.
• Fast Power-up — Powers up in microseconds for rapid system availability.
• In-field Reconfiguration (TransFR) — Supports background and in-field updates to logic while the system operates (TransFR).
• Memory — Approximately 6.1 Kbits of distributed RAM (MachXO640 family); no embedded block SRAM on this device.
• Programming & System Support — SRAM and non-volatile memory are programmable through the JTAG port; IEEE 1532 in-system programming supported at the family level.
• Flexible I/O Standards — Programmable I/O buffers support a wide range of interfaces documented for the MachXO family, including multiple LVCMOS levels, LVTTL, PCI, LVDS and related standards.
• Power Management — Sleep mode enables significant static current reduction (up to 100× as specified for the family).
• Industrial Grade & Compliance — Rated for industrial operating temperatures (–40 °C to 100 °C) and RoHS compliant.

Typical Applications

• Glue Logic and Board-Level Control — Implement address decoding, control sequencing and custom glue logic for system integration.
• Bus Bridging and Interfacing — Bridge and adapt between different bus standards using flexible I/O and programmable logic.
• Power-Up and Reset Control — Fast power-up behavior and single-chip configuration simplify power sequencing and system initialization.
• Peripheral and Sensor Interfaces — Concentrate I/O and logic to interface with sensors, ADC/DAC front-ends and peripheral devices.

Unique Advantages

• Instant-on, single-chip solution: Eliminates external configuration memory and reduces BOM while providing rapid system availability.
• In-field update capability: TransFR and background programming enable firmware updates and iterative development without full system downtime.
• High I/O-to-logic ratio: 101 I/Os paired with 640 logic elements allow dense interface implementations in a compact package.
• Low-power modes: Sleep mode supports significant static current reduction for power-sensitive designs.
• Industrial temperature range: –40 °C to 100 °C rating supports deployment in a wide range of environments.
• Design tool support (MachXO family): Family-level design and programming flows facilitate development and migration across MachXO devices.

Why Choose LCMXO640C-3M132I?

The LCMXO640C-3M132I positions itself as a compact, non-volatile FPGA tailored for board control, interface bridging and power sequencing roles where instant-on behavior and in-field configurability matter. Its combination of 640 logic elements, 101 I/Os and a 132-ball CSPBGA package delivers a balance of connectivity and logic for space- and cost-constrained designs.

With family-level features such as single-chip configuration, in-system programming via JTAG and support for a broad set of I/O standards, this device is well suited to engineers seeking a reconfigurable, industrial-temperature solution that reduces external components and accelerates bring-up and iterative updates.

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