LCMXO640C-3FTN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 677 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-3FTN256I – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA
The LCMXO640C-3FTN256I is a MachXO family FPGA offering a non-volatile, instant-on single-chip solution for glue logic, bus bridging, power-up control and general control logic. It delivers 640 logic elements and up to 159 I/Os in a compact 256-ball BGA package targeted at industrial-grade applications.
Designed around a grid of logic blocks with programmable I/O, this device combines instant-on configuration without external memory, flexible I/O options, and in-field reconfiguration capabilities for system designs that require fast startup and secure configuration.
Key Features
- Core Logic — 640 logic elements provided in an architecture of approximately 80 logic blocks for implementing glue logic and control functions.
- Distributed Memory — MachXO family support includes distributed RAM; family documentation lists roughly 6.1 Kbits of distributed RAM for the LCMXO640 device.
- Non-Volatile Configuration — Single-chip, non-volatile architecture enables instant-on behavior without external configuration memory; supports background programming.
- Reconfiguration — TransFR™ in-field reconfiguration and the ability to reprogram SRAM-based logic in milliseconds for field updates while the system operates.
- Flexible I/O — Up to 159 I/O pins with programmable sysIO™ buffer options (family-level support for LVCMOS, LVTTL, PCI, LVDS and other interfaces noted in family documentation).
- Power and Low-Power Modes — Support for sleep mode to significantly reduce static current; operates across a supply range of 1.71 V to 3.465 V.
- Package & Mounting — Surface-mount 256-ball ftBGA / 256-LBGA package (17 × 17 mm form factor) for high pin-count in a compact footprint.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C and RoHS compliant.
Typical Applications
- Glue Logic & System Control — Implement power-up sequencing, reset control, and general-purpose control logic where instant-on behavior and secure single-chip configuration matter.
- Bus Bridging & Interfacing — Bridge between buses and perform protocol adaptation using abundant I/O and flexible buffer options described for the MachXO family.
- Peripheral & Sensor Interfaces — Aggregate and condition signals from multiple peripherals or sensors, leveraging the device’s high I/O count and reprogrammability.
- Field-Updatable Systems — Systems requiring in-field logic updates can use TransFR reconfiguration and background non-volatile programming capabilities to deploy updates without external configuration memory.
Unique Advantages
- Instant-on single-chip configuration: Eliminates the need for external configuration memory and reduces system complexity and boot time.
- Field reconfiguration support: TransFR and background programming enable safe in-field updates and iterative product enhancements.
- Compact, high-pin-count package: 256-ball ftBGA provides 159 I/Os in a small footprint for space-constrained industrial designs.
- Wide supply and temperature range: Operates from 1.71 V to 3.465 V and from −40 °C to 100 °C to meet a range of industrial environmental requirements.
- Low-power modes: Sleep mode capability reduces static current for power-sensitive applications.
- RoHS compliant: Environmentally compliant packaging for global manufacturing requirements.
Why Choose LCMXO640C-3FTN256I?
The LCMXO640C-3FTN256I positions itself as a versatile MachXO family member for engineers who need secure, instant-on logic with high I/O density and field-programmable flexibility. With 640 logic elements, approximately 6.1 Kbits of distributed RAM (family documentation), and support for in-field reconfiguration, it fits designs that require rapid startup, secure configuration, and the ability to evolve functionality after deployment.
This industrial-grade device is suited to system designers in industrial and embedded markets seeking a compact BGA package with broad I/O, low-power options, and the non-volatile configuration benefits of the MachXO family. Its combination of single-chip configuration, reprogramming capability, and a robust operating range delivers long-term value for scalable, maintainable designs.
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