LCMXO640C-3M100C

The LCMXO640C-3M100C is a MachXO family FPGA IC that combines non-volatile, instant-on operation with reconfigurable FPGA-style logic. Optimized for glue logic, bus bridging, I/O interfacing, power-up control and general control logic, the device delivers a compact single-chip solution for commercial embedded designs.

Architected for high I/O-to-logic density, the device supports rapid reconfiguration and in-field updates while eliminating the need for external configuration memory. It targets applications that require low board-level complexity, flexible I/O standards and predictable commercial temperature operation.

Key Features

• Non-volatile, instant-on architecture  Single-chip configuration with instant-on start-up and no external configuration memory required; SRAM-based logic can be reconfigured in milliseconds.
• Reconfiguration and field updates  Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates; device memory and SRAM can be programmed via JTAG.
• Logic density  Provides 640 logic elements for implementing glue logic, protocol bridging and control functions with a compact resource footprint.
• I/O and interface flexibility  74 I/Os with programmable sysIO™ buffer support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Memory resources (family-level)  The MachXO family includes distributed and embedded memory options; refer to the family datasheet for device-specific memory configurations applicable to LCMXO640.
• Power management  Sleep Mode provides up to 100× static current reduction for low standby power operation.
• Voltage and power supply range  Operates across a supply range of 1.71 V to 3.465 V to accommodate multiple logic domains.
• Package and mounting  Available in a 100-ball LFBGA/CSPBGA package (100-CSBGA, 8×8 mm) with surface-mount mounting for compact board integration.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C and RoHS-compliant packaging.

Typical Applications

• Glue logic and board-level control  Implements combinatorial and sequential glue logic between subsystems to reduce discrete gates and simplify BOM.
• Bus bridging and protocol conversion  Bridges different bus standards and performs protocol adaptation using flexible I/O buffers and plentiful I/Os.
• Power-up and system sequencing  Handles power-up control, reset sequencing and system supervision where deterministic instant-on behavior is required.
• Peripheral and user-interface control  Consolidates LED/indicator control, button handling, and peripheral glue into a single programmable device.

Unique Advantages

• Instant-on single-chip solution: Eliminates external configuration memory, simplifying board design and improving security by avoiding external bitstreams.
• Field reconfiguration capability: TransFR™ and JTAG-programmable memory enable in-field updates and background programming without removing the device from the system.
• Wide interface compatibility: Programmable sysIO buffers support many common signaling standards, reducing the need for level translators and discrete interface components.
• Compact package with ample I/O: 74 I/Os in a 100-ball csBGA footprint allow dense routing and small PCB area for space-constrained designs.
• Low-power standby: Sleep Mode provides significant static current reduction to support energy-conscious commercial applications.
• Toolchain support (family): The MachXO family is supported by ispLEVER design tools for synthesis, placement and routing of designs targeting these devices.

Why Choose LCMXO640C-3M100C?

The LCMXO640C-3M100C positions itself as a compact, reconfigurable building block for commercial embedded systems that require instant-on behavior, flexible I/O interfacing and the ability to perform in-field updates. Its combination of 640 logic elements, 74 I/Os and a small 100-ball BGA package makes it well suited for designers looking to reduce board-level complexity while retaining programmability.

Backed by MachXO family capabilities and supported design tools, the device provides a predictable upgrade path and practical integration for applications ranging from board glue logic to control and interfacing tasks in commercial products.

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