LCMXO640C-3FT256I

The LCMXO640C-3FT256I is a MachXO family FPGA offering non-volatile, instant-on configuration and flexible I/O in a compact 256-ball BGA package. Built for control, glue-logic and interfacing tasks, this device combines 640 logic elements with extensive I/O and power options to address industrial embedded applications.

As a MachXO device, it supports single-chip, no-external-configuration operation, in-field reconfiguration, and low-power sleep modes—making it suitable for designs that require secure startup behavior, field updates, and compact system integration.

Key Features

• Logic Capacity — 640 logic elements across 80 CLBs, enabling implementation of glue logic, control paths, and moderate combinational/sequential functions.
• I/O Density — 159 programmable I/O pins in the 256-ball package, providing broad interfacing capability for buses, peripherals and sensor networks.
• Non-volatile Instant-on — MachXO family architecture provides single-chip, non-volatile configuration for immediate power-up without external configuration memory.
• Reconfiguration and Programming — Supports in-field reconfiguration and background programming capability as part of the MachXO feature set, enabling updates while the system is in service.
• Embedded and Distributed Memory — Family-level support includes distributed RAM; for the LCMXO640 device the family specification lists approximately 6.1 Kbits of distributed RAM and no embedded block RAM (EBR).
• Flexible I/O Standards — Family sysIO buffer supports a wide range of interfaces (LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS) enabling compatibility with diverse peripherals.
• Power and Voltage — Operates across a broad supply range from 1.71 V to 3.465 V to support multiple system domains and I/O standards.
• Package & Mounting — Surface-mount 256-ball LBGA (supplier package: 256-FTBGA, 17×17 mm) for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• RoHS Compliant — Lead-free/RoHS-compliant package for regulatory and assembly compatibility.

Typical Applications

• Glue Logic and Bus Bridging — Implement address decoding, bus interfacing, and protocol translation between legacy and modern system buses.
• System Control and Power Sequencing — Handle power-up control, reset distribution, and supervisory sequencing with non-volatile instant-on behavior.
• Peripheral and Sensor Interfacing — Aggregate and format signals from sensors and peripherals using the device’s high I/O count and flexible I/O standards.
• In-field Logic Updates — Deploy configuration updates or fixes in the field using MachXO reconfiguration capabilities without removing the device from the system.

Unique Advantages

• Single-chip, instant-on operation: Eliminates the need for external configuration memory, simplifying BOM and ensuring fast, deterministic startup.
• High I/O-to-logic ratio: 159 I/Os paired with 640 logic elements provide efficient implementation of interface-heavy control and glue logic functions.
• Field reconfigurability: MachXO family support for background programming and in-field updates lets you evolve logic in deployed systems.
• Wide supply range: Operation from 1.71 V to 3.465 V enables use across multiple voltage domains and I/O standards without additional level-shifting in many cases.
• Industrial temperature capability: −40 °C to 100 °C rating supports reliable operation in demanding environments.
• Compact BGA package: 256-ball ftBGA footprint (17×17 mm supplier package) saves board area while delivering high pin count.

Why Choose LCMXO640C-3FT256I?

The LCMXO640C-3FT256I positions itself as a practical, integration-focused FPGA for designs that need instant-on non-volatile configuration, robust I/O capacity and industrial temperature operation. Its balance of 640 logic elements and 159 I/Os makes it well suited to control-plane functions, protocol bridging, and peripheral aggregation where board space and secure startup behavior matter.

Designed within the MachXO family, this device benefits from family-level features such as in-field reconfiguration, flexible I/O signaling, and sleep-mode power reduction—offering scalability and long-term design flexibility backed by established design tools and programming flows.

Request a quote or submit a sales inquiry to evaluate the LCMXO640C-3FT256I for your next design and to obtain pricing and availability details.