LCMXO640C-3F256I

The LCMXO640C-3F256I is a MachXO field programmable gate array (FPGA) in a 256-BGA package, offering a compact, surface-mount programmable logic solution for industrial applications. With 640 logic elements and 159 I/O, it is suited for designs requiring moderate logic density and flexible I/O routing within an industrial temperature range.

Engineered for board-level integration, this device operates across a broad supply range (1.71 V to 3.465 V) and supports deployment in environments from −40 °C to 100 °C, making it appropriate for a variety of industrial control and I/O-interfacing tasks.

Key Features

• Logic Capacity  640 logic elements organized as 80 configurable CLBs to implement glue logic, finite-state machines, and custom control functions.
• I/O Resources  159 available I/O pins to support diverse peripheral interfaces and signal routing on complex boards.
• Package  256-BGA package (supplier package: 256-FPBGA, 17×17 mm) designed for compact surface-mount integration on populated PCBs.
• Mounting Type  Surface mount, suitable for automated PCB assembly processes.
• Voltage Range  Wide operating supply range from 1.71 V to 3.465 V, enabling use with different core and I/O voltage domains.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• RoHS Compliant  Manufactured to meet RoHS requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Use the FPGA for custom control logic, signal conditioning, and I/O expansion in factory automation and process control equipment.
• Interface Bridging  Implement protocol adaptation and I/O translation where 159 I/O lines enable flexible interconnect between subsystems.
• Embedded System Glue Logic  Consolidate discrete logic functions and state machines to simplify board design and reduce component count.
• Prototyping and Development  Deploy as a reprogrammable building block for validating system architectures and iterating hardware designs.

Unique Advantages

• Compact BGA Footprint  256-BGA (17×17 mm) packaging provides a high-pin-count solution in a compact board footprint for space-constrained designs.
• Ample I/O  159 I/O pins enable direct connection to a wide range of peripherals and signal domains without extensive external multiplexing.
• Flexible Voltage Support  1.71 V to 3.465 V supply range allows integration with varied system power rails and mixed-voltage environments.
• Industrial Temperature Range  Rated −40 °C to 100 °C for reliable operation in demanding thermal environments.
• Surface-Mount Ready  Designed for standard surface-mount assembly processes to streamline manufacturing and lower assembly costs.
• RoHS Compliance  Environmentally compliant manufacturing supports modern assembly and regulatory requirements.

Why Choose LCMXO640C-3F256I?

The LCMXO640C-3F256I delivers a balanced combination of logic capacity, extensive I/O, and industrial-grade operating conditions in a compact 256-BGA package. It is a practical choice for engineers seeking a reprogrammable logic device that integrates cleanly into space- and temperature-constrained industrial systems.

Designed for projects that require flexibility at the board level—such as control logic consolidation, interface bridging, and rapid prototyping—this device offers predictable electrical and thermal operating windows and RoHS-compliant construction to support long-term deployment and manufacturing.

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