LCMXO640C-3B256I

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 1,249 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-3B256I – MachXO FPGA, 640 logic elements, 159 I/O, 256-LFBGA

The LCMXO640C-3B256I is a MachXO family field-programmable gate array (FPGA) offered in a 256-ball LFBGA/CSPBGA package. It combines non-volatile, instant-on configuration with a compact array of programmable logic, making it suitable for glue logic, bus interfacing, control functions and other embedded system tasks.

Built for industrial environments, this device provides 640 logic elements and up to 159 I/O pins in a 14×14 mm package, supporting a wide supply range and on-chip features that simplify system integration and in-field updates.

Key Features

  • Core Logic  640 logic elements for implementing glue logic, control state machines and bus handling functions.
  • Non-volatile, Instant-on Configuration  Single-chip non-volatile configuration enables power-up in microseconds with no external configuration memory required.
  • In-field Reconfiguration  TransFR™ reconfiguration supports in-system logic updates while the system operates; non-volatile and SRAM programmable through JTAG.
  • Flexible I/O  Up to 159 I/O pins with programmable sysIO™ buffer support for multiple interface standards and logic voltages.
  • Voltage Support  Operates across a wide supply range from 1.71 V to 3.465 V, enabling compatibility with mixed-voltage systems.
  • Memory  Distributed on-chip RAM available as part of the MachXO family architecture for localized data buffering and small storage needs.
  • Power Management  Sleep mode capability reduces static current draw for energy-sensitive applications.
  • Package and Mounting  Surface-mount 256-ball LFBGA / CSPBGA (14×14 mm) in a 256-CABGA supplier device package.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for industrial-class deployments.
  • Standards & System Support  Family-level support includes IEEE 1149.1 boundary scan and in-system programming standards to simplify manufacturing and field updates.

Typical Applications

  • Glue Logic & System Control  Compact, non-volatile FPGA for consolidating discrete logic and implementing control sequences at power-up.
  • Bus Bridging and Interfacing  Use as protocol translators or I/O adapters where multiple voltage domains and flexible I/O are required.
  • Power-Up & Reset Management  Instant-on configuration and programmable control logic enable reliable power sequencing and bring-up routines.
  • Embedded Control Functions  Implement state machines, peripheral control, and custom glue logic in industrial embedded systems.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates the need for external configuration memory and delivers fast power-up behavior.
  • High I/O-to-logic density: 159 I/O pins paired with 640 logic elements supports complex interfacing in a compact package.
  • Field-updatable logic: TransFR™ in-field reconfiguration and JTAG-programmable non-volatile memory allow iterative updates without board removal.
  • Wide voltage compatibility: Operates across 1.71 V to 3.465 V to accommodate mixed-voltage system designs.
  • Industrial robustness: Qualified for −40 °C to 100 °C operation for deployment in industrial environments.
  • Reduced system BOM: Integrated non-volatile configuration and flexible I/O reduce the number of external components required.

Why Choose LCMXO640C-3B256I?

The LCMXO640C-3B256I positions itself as a compact, industrial-grade programmable logic device that simplifies system design with non-volatile instant-on configuration, flexible I/O, and in-field reconfiguration. Its combination of 640 logic elements and 159 I/Os in a 256-ball LFBGA footprint makes it well suited for designers consolidating glue logic, bus interfaces, and control functions while minimizing external components.

For development and production, this device benefits from MachXO family system-level features such as boundary-scan and JTAG programmability, enabling streamlined manufacturing, secure configuration, and maintainable field updates.

Request a quote or contact sales to discuss availability, lead times, and pricing for the LCMXO640C-3B256I.

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