LCMXO3LF-9400E-6BG484I

IC FPGA 384 I/O 484CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA

Quantity 1,955 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-LFBGANumber of I/O384Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400E-6BG484I – MachXO3 FPGA, 9,400 Logic Elements, 384 I/Os, 484-LFBGA

The LCMXO3LF-9400E-6BG484I is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a non-volatile, multi-time programmable logic fabric with integrated system features designed for control, glue logic, and I/O-centric applications.

With approximately 9,400 logic elements, about 0.44 Mbits of embedded memory, and 384 I/Os in a compact 484-LFBGA package, this industrial-grade device targets designs that require high I/O density, flexible on-chip clocking, and built-in peripheral IP while operating across an extended temperature range.

Key Features

  • Logic Capacity — Approximately 9,400 logic elements for implementing control, glue logic, and custom digital functions.
  • Embedded Memory — Approximately 0.44 Mbits of sysMEM embedded block RAM for FIFOs, buffering, and small storage needs.
  • I/O Density — 384 programmable I/Os supporting high pin counts and complex interfacing requirements.
  • Flexible I/O and Source-Synchronous Support — Pre-engineered source-synchronous I/O and high-performance, flexible I/O buffers for reliable interfacing with external signals.
  • On-Chip Clocking and PLLs — Flexible on-chip clocking including sysCLOCK PLLs to support a variety of timing and clock-domain needs.
  • Non-Volatile Configuration & Reconfiguration — Non-volatile, multi-time programmable configuration with TransFR reconfiguration and User Flash Memory (UFM) for persistent data and flexible field updates.
  • Embedded Hardened IP — Integrated hardened peripheral IP including I²C, SPI, and timer/counter blocks to reduce external components and simplify design.
  • Power and Thermal — Operates from a supply range of 1.14 V to 1.26 V and rated for industrial operation from –40 °C to 100 °C.
  • Package & Mounting — 484-LFBGA (supplier package: 484-CABGA 19×19) in a surface-mount format for compact board-level integration.
  • Compliance — RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

  • System Glue Logic and Control — Implement board-level control, protocol bridging, and interface arbitration using the device's logic fabric and abundant I/Os.
  • Peripheral Interface and Sensor Bridging — Hardened I²C and SPI IP plus flexible I/O makes the device suitable for aggregating and translating sensor or peripheral signals.
  • Industrial Control and Monitoring — Industrial temperature grade (–40 °C to 100 °C) and high I/O count support rugged system control and monitoring tasks.
  • Boot and Configuration Management — Non-volatile multi-time programmable configuration and UFM enable reliable boot control, configuration storage, and field updates.

Unique Advantages

  • High I/O Integration: 384 I/Os reduce the need for external I/O expanders and simplify board-level routing for I/O-heavy designs.
  • Non-Volatile, Field-Programmable: Multi-time programmable non-volatile configuration allows secure, persistent logic without external configuration memory.
  • Embedded Peripheral IP: Hardened I²C, SPI, and timer/counter blocks lower BOM and accelerate time-to-market by reducing discrete components.
  • Industrial Temperature Range: Rated from –40 °C to 100 °C for deployment in demanding operating environments.
  • Compact, Surface-Mount Package: 484-LFBGA (19×19) provides a dense footprint for space-constrained PCBs while maintaining high pin count.
  • Integrated Clocking and Memory: On-chip PLLs and approximately 0.44 Mbits of embedded RAM support complex timing and buffering requirements without external parts.

Why Choose LCMXO3LF-9400E-6BG484I?

This MachXO3 device combines a non-volatile, reprogrammable logic fabric with plentiful I/Os, embedded memory, and hardened peripheral IP to deliver a compact, integrated solution for control, interfacing, and configuration tasks. Its industrial temperature rating and RoHS compliance make it suitable for demanding system-level deployments.

Designers seeking a scalable, reliable FPGA for board-level control, protocol bridging, or embedded configuration management will find the LCMXO3LF-9400E-6BG484I provides a balanced mix of logic capacity, I/O density, and system integration to reduce BOM and simplify development while supporting field updates and persistent configuration.

Request a quote or submit a quotation referencing part number LCMXO3LF-9400E-6BG484I to receive pricing and availability for your design needs.

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