LCMXO3LF-9400E-6BG484I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA |
|---|---|
| Quantity | 1,955 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 384 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3LF-9400E-6BG484I – MachXO3 FPGA, 9,400 Logic Elements, 384 I/Os, 484-LFBGA
The LCMXO3LF-9400E-6BG484I is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a non-volatile, multi-time programmable logic fabric with integrated system features designed for control, glue logic, and I/O-centric applications.
With approximately 9,400 logic elements, about 0.44 Mbits of embedded memory, and 384 I/Os in a compact 484-LFBGA package, this industrial-grade device targets designs that require high I/O density, flexible on-chip clocking, and built-in peripheral IP while operating across an extended temperature range.
Key Features
- Logic Capacity — Approximately 9,400 logic elements for implementing control, glue logic, and custom digital functions.
- Embedded Memory — Approximately 0.44 Mbits of sysMEM embedded block RAM for FIFOs, buffering, and small storage needs.
- I/O Density — 384 programmable I/Os supporting high pin counts and complex interfacing requirements.
- Flexible I/O and Source-Synchronous Support — Pre-engineered source-synchronous I/O and high-performance, flexible I/O buffers for reliable interfacing with external signals.
- On-Chip Clocking and PLLs — Flexible on-chip clocking including sysCLOCK PLLs to support a variety of timing and clock-domain needs.
- Non-Volatile Configuration & Reconfiguration — Non-volatile, multi-time programmable configuration with TransFR reconfiguration and User Flash Memory (UFM) for persistent data and flexible field updates.
- Embedded Hardened IP — Integrated hardened peripheral IP including I²C, SPI, and timer/counter blocks to reduce external components and simplify design.
- Power and Thermal — Operates from a supply range of 1.14 V to 1.26 V and rated for industrial operation from –40 °C to 100 °C.
- Package & Mounting — 484-LFBGA (supplier package: 484-CABGA 19×19) in a surface-mount format for compact board-level integration.
- Compliance — RoHS-compliant construction for environmental regulatory alignment.
Typical Applications
- System Glue Logic and Control — Implement board-level control, protocol bridging, and interface arbitration using the device's logic fabric and abundant I/Os.
- Peripheral Interface and Sensor Bridging — Hardened I²C and SPI IP plus flexible I/O makes the device suitable for aggregating and translating sensor or peripheral signals.
- Industrial Control and Monitoring — Industrial temperature grade (–40 °C to 100 °C) and high I/O count support rugged system control and monitoring tasks.
- Boot and Configuration Management — Non-volatile multi-time programmable configuration and UFM enable reliable boot control, configuration storage, and field updates.
Unique Advantages
- High I/O Integration: 384 I/Os reduce the need for external I/O expanders and simplify board-level routing for I/O-heavy designs.
- Non-Volatile, Field-Programmable: Multi-time programmable non-volatile configuration allows secure, persistent logic without external configuration memory.
- Embedded Peripheral IP: Hardened I²C, SPI, and timer/counter blocks lower BOM and accelerate time-to-market by reducing discrete components.
- Industrial Temperature Range: Rated from –40 °C to 100 °C for deployment in demanding operating environments.
- Compact, Surface-Mount Package: 484-LFBGA (19×19) provides a dense footprint for space-constrained PCBs while maintaining high pin count.
- Integrated Clocking and Memory: On-chip PLLs and approximately 0.44 Mbits of embedded RAM support complex timing and buffering requirements without external parts.
Why Choose LCMXO3LF-9400E-6BG484I?
This MachXO3 device combines a non-volatile, reprogrammable logic fabric with plentiful I/Os, embedded memory, and hardened peripheral IP to deliver a compact, integrated solution for control, interfacing, and configuration tasks. Its industrial temperature rating and RoHS compliance make it suitable for demanding system-level deployments.
Designers seeking a scalable, reliable FPGA for board-level control, protocol bridging, or embedded configuration management will find the LCMXO3LF-9400E-6BG484I provides a balanced mix of logic capacity, I/O density, and system integration to reduce BOM and simplify development while supporting field updates and persistent configuration.
Request a quote or submit a quotation referencing part number LCMXO3LF-9400E-6BG484I to receive pricing and availability for your design needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016