LCMXO3LF-9400E-6BG400I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 1,308 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3LF-9400E-6BG400I – MachXO3 Field Programmable Gate Array (FPGA) IC, 9,400 logic elements, 335 I/O, 400‑LFBGA
The LCMXO3LF-9400E-6BG400I is a MachXO3 family FPGA offering a flexible, non‑volatile programmable fabric intended for system control, I/O interfacing, and glue-logic integration. It combines 9,400 logic elements with a high-density I/O complement and on‑chip embedded memory to address designs that require significant I/O, configuration storage, and system-level integration in an industrial temperature range.
Designed with advanced packaging and system features from the MachXO3 family, this device targets applications that need multi‑time programmability, on‑chip peripherals, and robust clocking and I/O options while operating from a low core supply voltage.
Key Features
- Logic Capacity 9,400 logic elements (1175 logic blocks) for implementing glue logic, protocol bridges, and control functions.
- Embedded Memory Approximately 0.44 Mbits of on‑chip RAM (442,368 total RAM bits) for FIFOs, buffering, and small data stores.
- I/O Density & Flexibility 335 I/O pins to support extensive sensor, peripheral, and bus interfacing requirements; includes support for pre‑engineered source‑synchronous I/O and flexible I/O buffering as described in the MachXO3 family documentation.
- On‑chip Peripherals Hardened IP blocks referenced in the MachXO3 family include I²C, SPI, and timer/counter functions, plus user flash memory (UFM) for configuration and data storage.
- Clocking & Oscillator Flexible on‑chip clocking with PLLs and an on‑chip oscillator are part of the MachXO3 architecture for system clock generation and management.
- Non‑volatile, Multi‑time Programmable MachXO3 family devices are described as non‑volatile and multi‑time programmable, enabling in‑system updates and persistent configuration.
- Package & Mounting 400‑LFBGA package (supplier device package: 400‑CABGA, 17 × 17) designed for surface‑mount assembly.
- Power & Operating Conditions Specified core supply range of 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.
- System & Production Features Family features documented in the datasheet include TransFR reconfiguration, standby/power saving options, hot‑socketing support, boundary‑scan testability, TraceID, and enhanced system‑level support.
- Compliance RoHS compliant.
Typical Applications
- I/O expansion and protocol bridging High I/O count (335 pins) and flexible I/O buffering make the device suitable for consolidating interfaces and translating between buses.
- System control and glue logic 9,400 logic elements provide capacity for control state machines, sequencing logic, and peripheral aggregation in embedded systems.
- Boot/configuration and small data storage Non‑volatile multi‑time programmability together with UFM and embedded RAM support configuration management and runtime parameter storage.
- Industrial monitoring and control Industrial temperature rating (−40 °C to 100 °C) and surface‑mount 400‑LFBGA packaging suit deployment in factory and process control environments.
Unique Advantages
- High integration of logic, memory, and I/O Combines 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and 335 I/O pins to reduce external components and simplify system design.
- Non‑volatile, reprogrammable configuration Multi‑time programmability and on‑device UFM enable field updates and persistent configuration without external flash.
- System features from MachXO3 family Integrated clocking (PLLs, on‑chip oscillator), hardened peripheral IP (I²C, SPI, timers), and TraceID/standby options streamline common embedded tasks.
- Industrial temperature range Rated from −40 °C to 100 °C for reliable operation across a wide range of industrial environments.
- Compact BGA packaging 400‑LFBGA (17 × 17) delivers high pin density in a surface‑mount form factor for space‑constrained boards.
- Regulatory and production readiness RoHS compliance and documented test/configuration features (boundary scan, hot‑socketing guidelines) support manufacturability and regulatory needs.
Why Choose LCMXO3LF-9400E-6BG400I?
The LCMXO3LF-9400E-6BG400I positions itself as a versatile, non‑volatile FPGA option within the MachXO3 family for designers needing substantial I/O, moderate logic capacity, and embedded memory in an industrial‑rated package. Its combination of on‑chip peripherals, flexible clocking, and multi‑time programmability supports system integration tasks that reduce BOM and simplify board‑level architecture.
This device is suited for engineering teams building industrial control, interface bridging, and system configuration solutions that require stable operation across −40 °C to 100 °C and low‑voltage core operation. The MachXO3 family documentation and included system features help accelerate integration and long‑term maintainability.
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